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1. 
Cover image for Ambient Intelligence with Microsystems Augmented Materials and Smart Objects
Ambient Intelligence with Microsystems Augmented Materials and Smart Objects
Author 
Delaney, Kieran. author. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
http://dx.doi.org/10.1007/978-0-387-46264-6
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2. 
Cover image for Cyber-physical systems for innovating and transforming society 5.0
Cyber-physical systems for innovating and transforming society 5.0
Preferred Shelf Number 
T14.5 .C93 2025
Electronic Access 
https://onlinelibrary.wiley.com/doi/book/10.1002/9781394197750
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3. 
Cover image for Smart cyber-physical power systems : fundamental concepts, challenges, and solutions. Volume 1
Smart cyber-physical power systems : fundamental concepts, challenges, and solutions. Volume 1
Author 
Parizad, Ali, editor. Baghaee, Hamid Reza, editor. Rahman, Saifur, editor.
Preferred Shelf Number 
TJ213 .S485 2025
Electronic Access 
https://onlinelibrary.wiley.com/doi/book/10.1002/9781394191529
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4. 
Cover image for Proceedings of 2nd International Conference on Artificial Intelligence, Robotics, and Communication ICAIRC 2022
Proceedings of 2nd International Conference on Artificial Intelligence, Robotics, and Communication ICAIRC 2022
Author 
Yadav, Sanjay. editor. Kumar, Harish. editor. Kankar, Pavan Kumar. editor. Dai, Wanyang. editor. Huang, Fenghua. editor.
Preferred Shelf Number 
ONLINE
Electronic Access 
https://doi.org/10.1007/978-981-99-4554-2
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5. 
Cover image for Material-integrated intelligent systems : technology and applications
Material-integrated intelligent systems : technology and applications
Author 
Bosse, Stefan, author. Lehmhus, Dirk, author. Lang, Walter, author. Busse, Matthias (Materials scientist), author.
Preferred Shelf Number 
TA418.9 .S62
Electronic Access 
https://onlinelibrary.wiley.com/doi/book/10.1002/9783527679249
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