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1. 
Cover image for Tribology in chemical-mechanical planarization
Tribology in chemical-mechanical planarization
Author 
Liang, Hong. Craven, David.
Preferred Shelf Number 
TJ1075 .L53 2005
Format: 
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Beytepe Library~1
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2. 
Cover image for Advances in chemical mechanical planarization (CMP)
Advances in chemical mechanical planarization (CMP)
Author 
Babu, S. V., editor.
Preferred Shelf Number 
ONLINE
Electronic Access 
ScienceDirect http://www.sciencedirect.com/science/book/9780081001653
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3. 
Cover image for Microelectronic applications of chemical mechanical planarization
Microelectronic applications of chemical mechanical planarization
Author 
Li, Yuzhuo. Wiley InterScience (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
Contributor biographical information http://catdir.loc.gov/catdir/enhancements/fy0742/2007015557-b.html
John Wiley http://dx.doi.org/10.1002/9780470180907
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4. 
Cover image for Tribology in chemical-mechanical planarization
Tribology in chemical-mechanical planarization
Author 
Liang, Hong, 1961, author. Craven, David R., 1945-
Preferred Shelf Number 
TJ1075 .L49 2005
Electronic Access 
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5. 
Cover image for Chemical mechanical planarization of microelectronic materials
Chemical mechanical planarization of microelectronic materials
Author 
Steigerwald, Joseph M. Murarka, S. P. Gutmann, Ronald J. Wiley InterScience (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
John Wiley http://dx.doi.org/10.1002/9783527617746
Contributor biographical information http://catdir.loc.gov/catdir/bios/wiley041/96006198.html
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6. 
Cover image for Nanoparticle engineering for chemical-mechanical planarization : fabrication of next-generation nanodevices
Nanoparticle engineering for chemical-mechanical planarization : fabrication of next-generation nanodevices
Author 
Paik, Ungyu. Park, Jea-Gun.
Preferred Shelf Number 
TK7874.84
Electronic Access 
Taylor & Francis https://www.taylorfrancis.com/books/9780429291890
OCLC metadata license agreement http://www.oclc.org/content/dam/oclc/forms/terms/vbrl-201703.pdf
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7. 
Cover image for Microelectronic packaging
Microelectronic packaging
Author 
Datta, Madhav. Osaka, Tetsuya, 1945- Schultze, J. W. (Joachim Walter)
Preferred Shelf Number 
TK7870.15 .M53 2005
Electronic Access 
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8. 
Cover image for Chemical processing of ceramics.
Chemical processing of ceramics.
Author 
Lee, Burtrand Insung. Komarneni, Sridhar.
Preferred Shelf Number 
TP810.5 .C48 2005
Electronic Access 
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9. 
Cover image for Run-to-run control in semiconductor manufacturing
Run-to-run control in semiconductor manufacturing
Author 
Del Castillo, Enrique. Hurwitz, Arnon Max. Moyne, James.
Preferred Shelf Number 
TK7871.85 .R863 2001
Electronic Access 
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