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1. 
Cover image for VLSI-SoC: System-on-Chip in the Nanoscale Era - Design, Verification and Reliability 24th IFIP WG 10.5/IEEE International Conference on Very Large Scale Integration, VLSI-SoC 2016, Tallinn, Estonia, September 26-28, 2016, Revised Selected Papers
VLSI-SoC: System-on-Chip in the Nanoscale Era - Design, Verification and Reliability 24th IFIP WG 10.5/IEEE International Conference on Very Large Scale Integration, VLSI-SoC 2016, Tallinn, Estonia, September 26-28, 2016, Revised Selected Papers
Author 
Hollstein, Thomas. editor. Raik, Jaan. editor. Kostin, Sergei. editor. Tšertov, Anton. editor. O'Connor, Ian. editor.
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https://doi.org/10.1007/978-3-319-67104-8
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2. 
Cover image for Single-Photon Avalanche Diodes and Photon Counting Systems From Phototransduction to Circuit Architecture
Single-Photon Avalanche Diodes and Photon Counting Systems From Phototransduction to Circuit Architecture
Author 
Dandin, Marc. author. McFarlane, Nicole. author. Sajal, Md Sakibur. author. Dehghandehnavi, Fahimeh. author. Nouri, Babak. author.
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https://doi.org/10.1007/978-3-031-64334-7
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3. 
Cover image for Development of a Self-Sufficient, Wireless Sensor Node Using the Outer FML Layer as an Antenna
Development of a Self-Sufficient, Wireless Sensor Node Using the Outer FML Layer as an Antenna
Author 
Bornemann, Sarah. author. (orcid)0000-0002-1840-3591 SpringerLink (Online service)
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https://doi.org/10.1007/978-3-031-70648-6
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4. 
Cover image for AI-Enabled Electronic Circuit and System Design From Ideation to Utilization
AI-Enabled Electronic Circuit and System Design From Ideation to Utilization
Author 
Iranmanesh, Ali. editor. Sayadi, Hossein. editor. SpringerLink (Online service)
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ONLINE
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https://doi.org/10.1007/978-3-031-71436-8
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5. 
Cover image for Big Data Analytics in Intelligent IoT and Cyber-Physical Systems
Big Data Analytics in Intelligent IoT and Cyber-Physical Systems
Author 
Sharma, Nonita. editor. Mangla, Monika. editor. (orcid)0000-0002-1752-7226 Shinde, Subhash K. editor. SpringerLink (Online service)
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ONLINE
Electronic Access 
https://doi.org/10.1007/978-981-99-4518-4
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6. 
Cover image for Proceedings of 2023 11th China Conference on Command and Control
Proceedings of 2023 11th China Conference on Command and Control
Author 
SpringerLink (Online service)
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ONLINE
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https://doi.org/10.1007/978-981-99-9021-4
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7. 
Cover image for Proceedings of 2024 12th China Conference on Command and Control Volume I.
Proceedings of 2024 12th China Conference on Command and Control Volume I.
Author 
SpringerLink (Online service)
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ONLINE
Electronic Access 
https://doi.org/10.1007/978-981-97-7770-9
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8. 
Cover image for Proceedings of 2024 12th China Conference on Command and Control Volume II.
Proceedings of 2024 12th China Conference on Command and Control Volume II.
Author 
SpringerLink (Online service)
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ONLINE
Electronic Access 
https://doi.org/10.1007/978-981-97-7774-7
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9. 
Cover image for Chiplet Design and Heterogeneous Integration Packaging
Chiplet Design and Heterogeneous Integration Packaging
Author 
Lau, John H. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-981-19-9917-8
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10. 
Cover image for Hardware Protection through Obfuscation
Hardware Protection through Obfuscation
Author 
Forte, Domenic. editor. Bhunia, Swarup. editor. Tehranipoor, Mark M. editor. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-319-49019-9
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11. 
Cover image for Designing with Xilinx® FPGAs Using Vivado
Designing with Xilinx® FPGAs Using Vivado
Author 
Churiwala, Sanjay. editor. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-319-42438-5
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12. 
Cover image for Smart Systems Integration and Simulation
Smart Systems Integration and Simulation
Author 
Bombieri, Nicola. editor. Poncino, Massimo. editor. Pravadelli, Graziano. editor. (orcid)0000-0002-7833-1673 SpringerLink (Online service)
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https://doi.org/10.1007/978-3-319-27392-1
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