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1. 
Cover image for Modeling and Simulation for RF System Design
Modeling and Simulation for RF System Design
Author 
Frevert, Ronny. author. Haase, Joachim. author. Jancke, Roland. author. Knöchel, Uwe. author. Schwarz, Peter. author.
Preferred Shelf Number 
ONLINE
Electronic Access 
http://dx.doi.org/10.1007/0-387-27585-1
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2. 
Cover image for Introduction to Advanced System-on-Chip Test Design and Optimization
Introduction to Advanced System-on-Chip Test Design and Optimization
Author 
Larsson, Erik. author. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
http://dx.doi.org/10.1007/b135763
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3. 
Cover image for Sensing Technology Proceedings of ICST'15
Sensing Technology Proceedings of ICST'15
Author 
Suryadevara, Nagender Kumar. editor. George, Boby. editor. Jayasundera, Krishanthi P. editor. Mukhopadhyay, Subhas Chandra. editor. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
https://doi.org/10.1007/978-3-031-29871-4
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4. 
Cover image for Reliable Design of Electronic Equipment An Engineering Guide
Reliable Design of Electronic Equipment An Engineering Guide
Author 
Natarajan, Dhanasekharan. author. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
https://doi.org/10.1007/978-3-319-09111-2
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5. 
Cover image for The ELFNET Book on Failure Mechanisms, Testing Methods, and Quality Issues of Lead-Free Solder Interconnects
The ELFNET Book on Failure Mechanisms, Testing Methods, and Quality Issues of Lead-Free Solder Interconnects
Author 
Grossmann, Günter. editor. Zardini, Christian. editor. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
http://dx.doi.org/10.1007/978-0-85729-236-0
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6. 
Cover image for Reliability of Microtechnology Interconnects, Devices and Systems
Reliability of Microtechnology Interconnects, Devices and Systems
Author 
Liu, Johan. author. Salmela, Olli. author. Sarkka, Jussi. author. Morris, James E. author. Tegehall, Per-Erik. author.
Preferred Shelf Number 
ONLINE
Electronic Access 
http://dx.doi.org/10.1007/978-1-4419-5760-3
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7. 
Cover image for Applications of Finite Element Methods for Reliability Studies on ULSI Interconnections
Applications of Finite Element Methods for Reliability Studies on ULSI Interconnections
Author 
Tan, Cher Ming. author. Li, Wei. author. Gan, Zhenghao. author. Hou, Yuejin. author. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
http://dx.doi.org/10.1007/978-0-85729-310-7
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8. 
Cover image for Verformung und Schädigung von Werkstoffen der Aufbau- und Verbindungstechnik Das Verhalten im Mikrobereich
Verformung und Schädigung von Werkstoffen der Aufbau- und Verbindungstechnik Das Verhalten im Mikrobereich
Author 
Wiese, Steffen. author. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
http://dx.doi.org/10.1007/978-3-642-05463-1
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9. 
Cover image for Solder Joint Reliability Prediction for Multiple Environments
Solder Joint Reliability Prediction for Multiple Environments
Author 
Perkins, Andrew E. author. Sitaraman, Suresh K. author. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
http://dx.doi.org/10.1007/978-0-387-79394-8
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10. 
Cover image for Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging
Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging
Author 
Suhir, E. editor. Lee, Y. C. editor. Wong, C. P. editor. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
http://dx.doi.org/10.1007/0-387-32989-7
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11. 
Cover image for Lead-Free Electronic Solders A Special Issue of the Journal of Materials Science: Materials in Electronics
Lead-Free Electronic Solders A Special Issue of the Journal of Materials Science: Materials in Electronics
Author 
Subramanian, K. N. author. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
http://dx.doi.org/10.1007/978-0-387-48433-4
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12. 
Cover image for Solder Joint Technology Materials, Properties, and Reliability
Solder Joint Technology Materials, Properties, and Reliability
Author 
Tu, King-Ning. author. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
http://dx.doi.org/10.1007/978-0-387-38892-2
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