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1. 
Cover image for Recent Developments in Electrical and Electronics Engineering Select Proceedings of ICRDEEE 2022
Recent Developments in Electrical and Electronics Engineering Select Proceedings of ICRDEEE 2022
Author 
Singhal, Poonam. editor. Kalra, Sakshi. editor. Singh, Bhim. editor. Bansal, R. C. editor. SpringerLink (Online service)
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ONLINE
Electronic Access 
https://doi.org/10.1007/978-981-19-7993-4
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2. 
Cover image for Proceedings of the NIELIT's International Conference on Communication, Electronics and Digital Technology NICE-DT 2023
Proceedings of the NIELIT's International Conference on Communication, Electronics and Digital Technology NICE-DT 2023
Author 
Singh, Sri Niwas. editor. Mahanta, Saurov. editor. Singh, Yumnam Jayanta. editor. SpringerLink (Online service)
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https://doi.org/10.1007/978-981-99-1699-3
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3. 
Cover image for Proceedings of Trends in Electronics and Health Informatics TEHI 2022
Proceedings of Trends in Electronics and Health Informatics TEHI 2022
Author 
Mahmud, Mufti. editor. Mendoza-Barrera, Claudia. editor. Kaiser, M. Shamim. editor. Bandyopadhyay, Anirban. editor. Ray, Kanad. editor.
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https://doi.org/10.1007/978-981-99-1916-1
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4. 
Cover image for Micro-Electronics and Telecommunication Engineering Proceedings of 6th ICMETE 2022
Micro-Electronics and Telecommunication Engineering Proceedings of 6th ICMETE 2022
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Sharma, Devendra Kumar. editor. Peng, Sheng-Lung. editor. Sharma, Rohit. editor. Jeon, Gwanggil. editor. SpringerLink (Online service)
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https://doi.org/10.1007/978-981-19-9512-5
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5. 
Cover image for Proceedings of International Conference on Data, Electronics and Computing ICDEC 2022
Proceedings of International Conference on Data, Electronics and Computing ICDEC 2022
Author 
Das, Nibaran. editor. Binong, Juwesh. editor. Krejcar, Ondrej. editor. Bhattacharjee, Debotosh. editor. SpringerLink (Online service)
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https://doi.org/10.1007/978-981-99-1509-5
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6. 
Cover image for VLSI-SoC: Design and Engineering of Electronics Systems Based on New Computing Paradigms 26th IFIP WG 10.5/IEEE International Conference on Very Large Scale Integration, VLSI-SoC 2018, Verona, Italy, October 8–10, 2018, Revised and Extended Selected Papers
VLSI-SoC: Design and Engineering of Electronics Systems Based on New Computing Paradigms 26th IFIP WG 10.5/IEEE International Conference on Very Large Scale Integration, VLSI-SoC 2018, Verona, Italy, October 8–10, 2018, Revised and Extended Selected Papers
Author 
Bombieri, Nicola. editor. Pravadelli, Graziano. editor. Fujita, Masahiro. editor. Austin, Todd. editor. Reis, Ricardo. editor.
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https://doi.org/10.1007/978-3-030-23425-6
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7. 
Cover image for Advances in Electronics, Communication and Computing ETAEERE-2016
Advances in Electronics, Communication and Computing ETAEERE-2016
Author 
Kalam, Akhtar. editor. Das, Swagatam. editor. Sharma, Kalpana. editor. SpringerLink (Online service)
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https://doi.org/10.1007/978-981-10-4765-7
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8. 
Cover image for Advanced and Intelligent Control in Power Electronics and Drives
Advanced and Intelligent Control in Power Electronics and Drives
Author 
Orłowska-Kowalska, Teresa. editor. Blaabjerg, Frede. editor. Rodríguez, José. editor. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-319-03401-0
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9. 
Cover image for Proceedings of the 2012 International Conference on Communication, Electronics and Automation Engineering
Proceedings of the 2012 International Conference on Communication, Electronics and Automation Engineering
Author 
Yang, George. editor. SpringerLink (Online service)
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ONLINE(333474.1)
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http://dx.doi.org/10.1007/978-3-642-31698-2
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10. 
Cover image for 5G-based smart hospitals and healthcare systems : evaluation, integration, and deployment
5G-based smart hospitals and healthcare systems : evaluation, integration, and deployment
Author 
Kumar, Arun (Associate professor of electronics), editor. Chakravarty, Sumit (Associate professor of electrical engineering), editor. Aravinda, K., 1966- editor. Sharma, Mohit Kumar (Assistant professor), editor.
Preferred Shelf Number 
RA971.6
Electronic Access 
Taylor & Francis https://www.taylorfrancis.com/books/9781003403678
OCLC metadata license agreement http://www.oclc.org/content/dam/oclc/forms/terms/vbrl-201703.pdf
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11. 
Cover image for Artificial intelligence and blockchain in Industry 4.0
Artificial intelligence and blockchain in Industry 4.0
Author 
Sharma, Rohit (Assistant professor of electronics), editor. Mahapatra, Rajendra Prasad, editor. Jeon, Gwanggil, editor.
Preferred Shelf Number 
QA76.9 .B56
Electronic Access 
Taylor & Francis https://www.taylorfrancis.com/books/9781003452591
OCLC metadata license agreement http://www.oclc.org/content/dam/oclc/forms/terms/vbrl-201703.pdf
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12. 
Cover image for RECENT INNOVATIONS IN SCIENCES AND HUMANITIES
RECENT INNOVATIONS IN SCIENCES AND HUMANITIES
Author 
Priya, M. Anandan, V.
Preferred Shelf Number 
LB1028.3
Electronic Access 
Taylor & Francis https://www.taylorfrancis.com/books/9781003606611
OCLC metadata license agreement http://www.oclc.org/content/dam/oclc/forms/terms/vbrl-201703.pdf
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