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Cover image for ARTIFICIAL INTELLIGENCE AND INFORMATION TECHNOLOGIES. Volume 2 Proceedings of the International Conference on Artificial Intelligence and Information Technologies , 3-4 November 2023, Samarkand, Uzbekistan / edited by Arvind Dagur and Dhirendra Kumar Shukla [and 3 others].

ARTIFICIAL INTELLIGENCE AND INFORMATION TECHNOLOGIES. Volume 2 Proceedings of the International Conference on Artificial Intelligence and Information Technologies , 3-4 November 2023, Samarkand, Uzbekistan / edited by Arvind Dagur and Dhirendra Kumar Shukla [and 3 others].

Author

Dagur, Arvind. Shukla, Dhirendra Kumar.

Preferred Shelf Number

Q335

Electronic Access

Taylor & Francis https://www.taylorfrancis.com/books/9781003510833
OCLC metadata license agreement http://www.oclc.org/content/dam/oclc/forms/terms/vbrl-201703.pdf

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10.

Cover image for Advancement of intelligent computational methods and technologies : proceedings of 1st International Conference on Advancement of Intelligent Computational Methods and Technologies (AICMT2023)

Advancement of intelligent computational methods and technologies : proceedings of 1st International Conference on Advancement of Intelligent Computational Methods and Technologies (AICMT2023)

Author

International Conference on Advancement of Intelligent Computational Methods and Technologies (1st : 2023 : Greater Noida, India ; Online). Verma, O. P., editor. Verma, Seema, editor. Perumal, Thinagaran, editor.

Preferred Shelf Number

QA75.5

Electronic Access

Taylor & Francis https://www.taylorfrancis.com/books/9781003487906
OCLC metadata license agreement http://www.oclc.org/content/dam/oclc/forms/terms/vbrl-201703.pdf

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11.

Cover image for INDUSTRY 4.0 WITH MODERN TECHNOLOGY proceedings of the International Conference on Emerging Trends in Engineering and Technology-Industry 4.0 (ETETI-2023), IGIT Sarang, Odisha, India.

INDUSTRY 4.0 WITH MODERN TECHNOLOGY proceedings of the International Conference on Emerging Trends in Engineering and Technology-Industry 4.0 (ETETI-2023), IGIT Sarang, Odisha, India.

Author

International Conference on Emerging Trends in Engineering and Technology-Industry 4.0 (2023 : Odisha, India) Sethi, Srinivas.

Preferred Shelf Number

T59.6

Electronic Access

Taylor & Francis https://www.taylorfrancis.com/books/9781003450924
OCLC metadata license agreement http://www.oclc.org/content/dam/oclc/forms/terms/vbrl-201703.pdf

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12.

Cover image for Intelligent Circuits and Systems for SDG 3 - Good Health and well-being : proceedings of the International Conference on Intelligent Circuits and Systems (ICICS 2023), October 12-13th, 2023, Lovely Professional University, India

Intelligent Circuits and Systems for SDG 3 - Good Health and well-being : proceedings of the International Conference on Intelligent Circuits and Systems (ICICS 2023), October 12-13th, 2023, Lovely Professional University, India

Author

International Conference on Intelligent Circuits and Systems (2023 : New Delhi, India), issuing body. Dharman, Bhaveshkumar Choithram, editor. Tripathi, Suman Lata, editor.

Preferred Shelf Number

TK7874

Electronic Access

Taylor & Francis https://www.taylorfrancis.com/books/9781003521716
OCLC metadata license agreement http://www.oclc.org/content/dam/oclc/forms/terms/vbrl-201703.pdf

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