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1. 
Cover image for Circuit Design for Reliability
Circuit Design for Reliability
Author 
Reis, Ricardo. editor. Cao, Yu. editor. Wirth, Gilson. editor. SpringerLink (Online service)
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Electronic Access 
https://doi.org/10.1007/978-1-4614-4078-9
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2. 
Cover image for Interconnect Reliability in Advanced Memory Device Packaging
Interconnect Reliability in Advanced Memory Device Packaging
Author 
Gan, Chong Leong,. author. Huang, Chen-Yu,. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-031-26708-6
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3. 
Cover image for Lifetime Reliability-aware Design of Integrated Circuits
Lifetime Reliability-aware Design of Integrated Circuits
Author 
Raji, Mohsen. author. Ghavami, Behnam. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-031-15345-7
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4. 
Cover image for Reliability Physics and Engineering Time-To-Failure Modeling
Reliability Physics and Engineering Time-To-Failure Modeling
Author 
McPherson, J. W. author. SpringerLink (Online service)
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Electronic Access 
https://doi.org/10.1007/978-3-319-93683-3
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5. 
Cover image for Fundamentals of Lead-Free Solder Interconnect Technology From Microstructures to Reliability
Fundamentals of Lead-Free Solder Interconnect Technology From Microstructures to Reliability
Author 
Lee, Tae-Kyu. author. Bieler, Thomas R. author. Kim, Choong-Un. author. Ma, Hongtao. author. SpringerLink (Online service)
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ONLINE
Electronic Access 
https://doi.org/10.1007/978-1-4614-9266-5
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6. 
Cover image for Silicon Analog Components Device Design, Process Integration, Characterization, and Reliability
Silicon Analog Components Device Design, Process Integration, Characterization, and Reliability
Author 
El-Kareh, Badih. author. Hutter, Lou N. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-1-4939-2751-7
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7. 
Cover image for Flash Memories Economic Principles of Performance, Cost and Reliability Optimization
Flash Memories Economic Principles of Performance, Cost and Reliability Optimization
Author 
Richter, Detlev. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-94-007-6082-0
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8. 
Cover image for Reliability of High Mobility SiGe Channel MOSFETs for Future CMOS Applications
Reliability of High Mobility SiGe Channel MOSFETs for Future CMOS Applications
Author 
Franco, Jacopo. author. Kaczer, Ben. author. Groeseneken, Guido. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-94-007-7663-0
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9. 
Cover image for More-than-Moore Devices and Integration for Semiconductors
More-than-Moore Devices and Integration for Semiconductors
Author 
Iacopi, Francesca. editor. Balestra, Francis. editor. SpringerLink (Online service)
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Electronic Access 
https://doi.org/10.1007/978-3-031-21610-7
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10. 
Cover image for Emerging Electronic Devices, Circuits and Systems Select Proceedings of EEDCS Workshop Held in Conjunction with ISDCS 2022
Emerging Electronic Devices, Circuits and Systems Select Proceedings of EEDCS Workshop Held in Conjunction with ISDCS 2022
Author 
Giri, Chandan. editor. Iizuka, Takahiro. editor. Rahaman, Hafizur. editor. Bhattacharya, Bhargab B. editor. SpringerLink (Online service)
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Electronic Access 
https://doi.org/10.1007/978-981-99-0055-8
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11. 
Cover image for Software Defined Chips Volume II
Software Defined Chips Volume II
Author 
Liu, Leibo. author. Wei, Shaojun. author. Zhu, Jianfeng. author. Deng, Chenchen. author. SpringerLink (Online service)
Preferred Shelf Number 
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Electronic Access 
https://doi.org/10.1007/978-981-19-7636-0
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12. 
Cover image for The Electrical Contact of the Pantograph-Catenary System Theory and Application
The Electrical Contact of the Pantograph-Catenary System Theory and Application
Author 
Wu, Guangning. author. Gao, Guoqiang. author. Wei, Wenfu. author. Yang, Zefeng. author. SpringerLink (Online service)
Preferred Shelf Number 
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https://doi.org/10.1007/978-981-13-6589-8
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