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1. 
Cover image for Modular Multilevel Converter Modelling and Simulation for HVDC Systems State of the Art and a Novel Approach
Modular Multilevel Converter Modelling and Simulation for HVDC Systems State of the Art and a Novel Approach
Author 
del Giudice, Davide. author. Bizzarri, Federico. author. Linaro, Daniele. author. Brambilla, Angelo Maurizio. author. SpringerLink (Online service)
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Electronic Access 
https://doi.org/10.1007/978-3-031-12818-9
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2. 
Cover image for Alternating Current Multi-Circuit Electric Machines A New Approach to the Steady-State Parameter Determination
Alternating Current Multi-Circuit Electric Machines A New Approach to the Steady-State Parameter Determination
Author 
Asanbayev, Valentin. author. SpringerLink (Online service)
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Electronic Access 
https://doi.org/10.1007/978-3-319-10109-5
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3. 
Cover image for Novel Three-state Quantum Dot Gate Field Effect Transistor Fabrication, Modeling and Applications
Novel Three-state Quantum Dot Gate Field Effect Transistor Fabrication, Modeling and Applications
Author 
Karmakar, Supriya. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-81-322-1635-3
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4. 
Cover image for Light-Emitting Diodes Materials, Processes, Devices and Applications
Light-Emitting Diodes Materials, Processes, Devices and Applications
Author 
Li, Jinmin. editor. Zhang, G. Q. editor. SpringerLink (Online service)
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Electronic Access 
https://doi.org/10.1007/978-3-319-99211-2
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5. 
Cover image for Thermal Management for LED Applications
Thermal Management for LED Applications
Author 
Lasance, Clemens J.M. editor. Poppe, András. editor. SpringerLink (Online service)
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https://doi.org/10.1007/978-1-4614-5091-7
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6. 
Cover image for Signals and Systems A Practical Approach
Signals and Systems A Practical Approach
Author 
Sundararajan, D. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-031-19377-4
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7. 
Cover image for Chiplet Design and Heterogeneous Integration Packaging
Chiplet Design and Heterogeneous Integration Packaging
Author 
Lau, John H. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-981-19-9917-8
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8. 
Cover image for Biomedical Electronics, Noise Shaping ADCs, and Frequency References Advances in Analog Circuit Design 2022
Biomedical Electronics, Noise Shaping ADCs, and Frequency References Advances in Analog Circuit Design 2022
Author 
Harpe, Pieter. editor. Baschirotto, Andrea. editor. Makinwa, Kofi A.A. editor. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-031-28912-5
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9. 
Cover image for Fundamentals of Modern Electric Circuit Analysis and Filter Synthesis A Transfer Function Approach
Fundamentals of Modern Electric Circuit Analysis and Filter Synthesis A Transfer Function Approach
Author 
Izadian, Afshin. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-031-21908-5
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10. 
Cover image for Proceedings of SIE 2022 53rd Annual Meeting of the Italian Electronics Society
Proceedings of SIE 2022 53rd Annual Meeting of the Italian Electronics Society
Author 
Cocorullo, Giuseppe. editor. Crupi, Felice. editor. Limiti, Ernesto. editor. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-031-26066-7
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11. 
Cover image for Interconnect Reliability in Advanced Memory Device Packaging
Interconnect Reliability in Advanced Memory Device Packaging
Author 
Gan, Chong Leong,. author. Huang, Chen-Yu,. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-031-26708-6
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12. 
Cover image for More-than-Moore Devices and Integration for Semiconductors
More-than-Moore Devices and Integration for Semiconductors
Author 
Iacopi, Francesca. editor. Balestra, Francis. editor. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-031-21610-7
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