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1. 
Cover image for Three-Dimensional Television Capture, Transmission, Display
Three-Dimensional Television Capture, Transmission, Display
Author 
Ozaktas, Haldun M. editor. Onural, Levent. editor. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
http://dx.doi.org/10.1007/978-3-540-72532-9
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2. 
Cover image for Three-Dimensional Nanoarchitectures Designing Next-Generation Devices
Three-Dimensional Nanoarchitectures Designing Next-Generation Devices
Author 
Zhou, Weilie. editor. Wang, Zhong Lin. editor. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
http://dx.doi.org/10.1007/978-1-4419-9822-4
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3. 
Cover image for Stability Loss and Buckling Delamination Three-Dimensional Linearized Approach for Elastic and Viscoelastic Composites
Stability Loss and Buckling Delamination Three-Dimensional Linearized Approach for Elastic and Viscoelastic Composites
Author 
Akbarov, Surkay. author. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE(333312.1)
Electronic Access 
http://dx.doi.org/10.1007/978-3-642-30290-9
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4. 
Cover image for Detection of Fetal Abnormalities Based on Three Dimensional Nuchal Translucency
Detection of Fetal Abnormalities Based on Three Dimensional Nuchal Translucency
Author 
Lai, Khin Wee. author. Supriyanto, Eko. author. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE(336503.1)
Electronic Access 
http://dx.doi.org/10.1007/978-981-4021-96-8
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5. 
Cover image for Fabrication and Characterization in the Micro-Nano Range New Trends for Two and Three Dimensional Structures
Fabrication and Characterization in the Micro-Nano Range New Trends for Two and Three Dimensional Structures
Author 
Lasagni, Fernando A. editor. Lasagni, Andrés F. editor. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
http://dx.doi.org/10.1007/978-3-642-17782-8
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6. 
Cover image for Three Dimensional Integrated Circuit Design EDA, Design and Microarchitectures
Three Dimensional Integrated Circuit Design EDA, Design and Microarchitectures
Author 
Xie, Yuan. editor. Cong, Jason. editor. Sapatnekar, Sachin. editor. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
http://dx.doi.org/10.1007/978-1-4419-0784-4
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7. 
Cover image for Bioinspired materials science and engineering
Bioinspired materials science and engineering
Author 
Yang, Guang, 1968 April 18- editor. Xiao, Lin, 1986- editor. Lamboni, Lallepak, 1988- editor.
Preferred Shelf Number 
QP517 .B56
Electronic Access 
https://onlinelibrary.wiley.com/doi/book/10.1002/9781119390350
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8. 
Cover image for Networks-on-Chips : Theory and Practice
Networks-on-Chips : Theory and Practice
Author 
El-Kharashi, Mohamed Watheq, editor. Elmiligi, Haytham, editor. Gebali, Fayez, editor. Taylor and Francis.
Preferred Shelf Number 
TK5105.546
Electronic Access 
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