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1. 
Cover image for Analysis and Mathematical Models of Canned Electrical Machine Drives In Particular a Canned Switched Reluctance Machine
Analysis and Mathematical Models of Canned Electrical Machine Drives In Particular a Canned Switched Reluctance Machine
Author 
Yu, Qiang. author. Wang, Xuesong. author. Cheng, Yuhu. author. Tian, Lisi. author. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
https://doi.org/10.1007/978-981-13-2745-2
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2. 
Cover image for Sustainable thermal storage systems planning, design, and operations
Sustainable thermal storage systems planning, design, and operations
Author 
Hyman, Lucas B.
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ONLINE
Electronic Access 
Subscription required
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3. 
Cover image for Proceedings of 10th International Conference on Recent Advances in Civil Aviation
Proceedings of 10th International Conference on Recent Advances in Civil Aviation
Author 
Gorbachev, Oleg Anatolyevich. editor. Gao, Xiaoguang. editor. Li, Bo. editor. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
https://doi.org/10.1007/978-981-19-3788-0
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4. 
Cover image for Recent Advances in Thermal Sciences and Engineering Select Proceedings of ICAFFTS 2021
Recent Advances in Thermal Sciences and Engineering Select Proceedings of ICAFFTS 2021
Author 
Mehta, Hemant B. editor. Rathod, Manish K. editor. Abiev, Rufat. editor. Arıcı, Müslüm. editor. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
https://doi.org/10.1007/978-981-19-7214-0
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5. 
Cover image for Design of thermal energy systems
Design of thermal energy systems
Author 
Majumdar, Pradip, 1954- author.
Preferred Shelf Number 
TJ808 .M345 2021
Electronic Access 
https://onlinelibrary.wiley.com/doi/book/10.1002/9781118956922
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6. 
Cover image for Thermal Energy Storage Using Phase Change Materials Fundamentals and Applications
Thermal Energy Storage Using Phase Change Materials Fundamentals and Applications
Author 
Fleischer, Amy S. author. SpringerLink (Online service)
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ONLINE
Electronic Access 
https://doi.org/10.1007/978-3-319-20922-7
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7. 
Cover image for Thermal Transport in Oblique Finned Micro/Minichannels
Thermal Transport in Oblique Finned Micro/Minichannels
Author 
Fan, Yan. author. Lee, Poh Seng. author. Singh, Pawan Kumar. author. Lee, Yong Jiun. author. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
https://doi.org/10.1007/978-3-319-09647-6
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8. 
Cover image for Oscillating Heat Pipes
Oscillating Heat Pipes
Author 
Ma, Hongbin. author. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
https://doi.org/10.1007/978-1-4939-2504-9
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9. 
Cover image for Wafer-Level Chip-Scale Packaging Analog and Power Semiconductor Applications
Wafer-Level Chip-Scale Packaging Analog and Power Semiconductor Applications
Author 
Qu, Shichun. author. Liu, Yong. author. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
https://doi.org/10.1007/978-1-4939-1556-9
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