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1. 
Cover image for Proceedings of Second International Conference in Mechanical and Energy Technology ICMET 2021, India
Proceedings of Second International Conference in Mechanical and Energy Technology ICMET 2021, India
Author 
Yadav, Sanjay. editor. Haleem, Abid. editor. Arora, P. K. editor. Kumar, Harish. editor. SpringerLink (Online service)
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ONLINE
Electronic Access 
https://doi.org/10.1007/978-981-19-0108-9
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2. 
Cover image for A Practical Guide to Design for Additive Manufacturing
A Practical Guide to Design for Additive Manufacturing
Author 
Diegel, Olaf. author. Nordin, Axel. author. Motte, Damien. author. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
https://doi.org/10.1007/978-981-13-8281-9
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3. 
Cover image for Micro and Nano Machining of Engineering Materials Recent Developments
Micro and Nano Machining of Engineering Materials Recent Developments
Author 
Kumar, Kaushik. editor. (orcid)0000-0002-4237-2836 Zindani, Divya. editor. (orcid)0000-0002-9941-593X Kumari, Nisha. editor. Davim, J. Paulo. editor. (orcid)0000-0002-5659-3111 SpringerLink (Online service)
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Electronic Access 
https://doi.org/10.1007/978-3-319-99900-5
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4. 
Cover image for Hybrid Micro-Machining Processes
Hybrid Micro-Machining Processes
Author 
Bhowmik, Sumit. author. Zindani, Divya. author. (orcid)0000-0002-9941-593X SpringerLink (Online service)
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ONLINE
Electronic Access 
https://doi.org/10.1007/978-3-030-13039-8
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5. 
Cover image for Additive Manufacturing of Emerging Materials
Additive Manufacturing of Emerging Materials
Author 
AlMangour, Bandar. editor. SpringerLink (Online service)
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ONLINE
Electronic Access 
https://doi.org/10.1007/978-3-319-91713-9
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6. 
Cover image for Metrology
Metrology
Author 
Gao, Wei. editor. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
https://doi.org/10.1007/978-981-10-4938-5
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7. 
Cover image for Advanced Packaging and Manufacturing Technology Based on Adhesion Engineering Wafer-Level Transfer Packaging and Fabrication Techniques Using Interface Energy Control Method
Advanced Packaging and Manufacturing Technology Based on Adhesion Engineering Wafer-Level Transfer Packaging and Fabrication Techniques Using Interface Energy Control Method
Author 
Seok, Seonho. author. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
https://doi.org/10.1007/978-3-319-77872-3
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8. 
Cover image for Electrohydrodynamic Direct-Writing for Flexible Electronic Manufacturing
Electrohydrodynamic Direct-Writing for Flexible Electronic Manufacturing
Author 
Yin, Zhouping. author. Huang, Yongan. author. Duan, Yongqing. author. Zhang, Haitao. author. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
https://doi.org/10.1007/978-981-10-4759-6
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9. 
Cover image for Advanced Noncontact Cutting and Joining Technologies Micro- and Nano-manufacturing
Advanced Noncontact Cutting and Joining Technologies Micro- and Nano-manufacturing
Author 
Mahamood, Rasheedat Modupe. author. Akinlabi, Esther Titilayo. author. SpringerLink (Online service)
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ONLINE
Electronic Access 
https://doi.org/10.1007/978-3-319-75118-4
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10. 
Cover image for Additive Manufacturing Technologies 3D Printing, Rapid Prototyping, and Direct Digital Manufacturing
Additive Manufacturing Technologies 3D Printing, Rapid Prototyping, and Direct Digital Manufacturing
Author 
Gibson, Ian. author. Rosen, David. author. Stucker, Brent. author. SpringerLink (Online service)
Preferred Shelf Number 
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Electronic Access 
https://doi.org/10.1007/978-1-4939-2113-3
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11. 
Cover image for Emerging nanotechnologies for manufacturing
Emerging nanotechnologies for manufacturing
Author 
Ahmed, Waqar. Jackson, Mark J.
Preferred Shelf Number 
ONLINE
Electronic Access 
ScienceDirect http://www.sciencedirect.com/science/book/9780815515838
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