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1. 
Cover image for High Performance Multi-Channel High-Speed I/O Circuits
High Performance Multi-Channel High-Speed I/O Circuits
Author 
Oh, Taehyoun. author. Harjani, Ramesh. author. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
https://doi.org/10.1007/978-1-4614-4963-8
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2. 
Cover image for Polymeric materials for electronic packaging
Polymeric materials for electronic packaging
Author 
Nakamura, Shozo (Professor Emeritus), author.
Preferred Shelf Number 
QD382 .C66 N35 2023
Electronic Access 
https://onlinelibrary.wiley.com/doi/book/10.1002/9781394188826
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3. 
Cover image for Novel advances in microsystems technologies and their applications
Novel advances in microsystems technologies and their applications
Author 
Francis, Laurent A., editor. Iniewski, Krzysztof, 1960- editor.
Preferred Shelf Number 
TK7874 .N666 2014
Electronic Access 
Click here to view.
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4. 
Cover image for Lattice engineering : technology and applications
Lattice engineering : technology and applications
Author 
Wang, Shumin.
Preferred Shelf Number 
TA403 .L38 2013
Electronic Access 
Click here to view.
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