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1. 
Cover image for High-Temperature Superconducting Microwave Circuits and Applications
High-Temperature Superconducting Microwave Circuits and Applications
Author 
Liu, Haiwen. author. Ren, Baoping. author. Guan, Xuehui. author. Wen, Pin. author. Zuo, Tao. author.
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ONLINE
Electronic Access 
https://doi.org/10.1007/978-981-13-6868-4
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2. 
Cover image for Liquid Crystal Display Drivers Techniques and Circuits
Liquid Crystal Display Drivers Techniques and Circuits
Author 
Cristaldi, David J.R. author. Pennisi, Salvatore. author. Pulvirenti, Francesco. author. SpringerLink (Online service)
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Electronic Access 
http://dx.doi.org/10.1007/978-90-481-2255-4
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3. 
Cover image for Ferroelectrics in Microwave Devices, Circuits and Systems Physics, Modeling, Fabrication and Measurements
Ferroelectrics in Microwave Devices, Circuits and Systems Physics, Modeling, Fabrication and Measurements
Author 
Gevorgian, Spartak. author. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-1-84882-507-9
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4. 
Cover image for Silicon Quantum Integrated Circuits Silicon-Germanium Heterostructure Devices: Basics and Realisations
Silicon Quantum Integrated Circuits Silicon-Germanium Heterostructure Devices: Basics and Realisations
Author 
Kasper, Erich. author. Paul, D.J. author. SpringerLink (Online service)
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http://dx.doi.org/10.1007/b137494
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5. 
Cover image for Gallium Nitride-enabled High Frequency and High Efficiency Power Conversion
Gallium Nitride-enabled High Frequency and High Efficiency Power Conversion
Author 
Meneghesso, Gaudenzio. editor. Meneghini, Matteo. editor. Zanoni, Enrico. editor. SpringerLink (Online service)
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Electronic Access 
https://doi.org/10.1007/978-3-319-77994-2
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6. 
Cover image for Applications of Organic and Printed Electronics A Technology-Enabled Revolution
Applications of Organic and Printed Electronics A Technology-Enabled Revolution
Author 
Cantatore, Eugenio. editor. SpringerLink (Online service)
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ONLINE(331320.1)
Electronic Access 
http://dx.doi.org/10.1007/978-1-4614-3160-2
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7. 
Cover image for Three Dimensional Integrated Circuit Design EDA, Design and Microarchitectures
Three Dimensional Integrated Circuit Design EDA, Design and Microarchitectures
Author 
Xie, Yuan. editor. Cong, Jason. editor. Sapatnekar, Sachin. editor. SpringerLink (Online service)
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Electronic Access 
http://dx.doi.org/10.1007/978-1-4419-0784-4
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8. 
Cover image for Carbon Nanotube Electronics
Carbon Nanotube Electronics
Author 
Kong, Jing. editor. Javey, Ali. editor. SpringerLink (Online service)
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Electronic Access 
http://dx.doi.org/10.1007/978-0-387-69285-2
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9. 
Cover image for Organic Field Effect Transistors Theory, Fabrication and Characterization
Organic Field Effect Transistors Theory, Fabrication and Characterization
Author 
Kymissis, Ioannis. author. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-0-387-92134-1
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10. 
Cover image for Wafer Level 3-D ICs Process Technology
Wafer Level 3-D ICs Process Technology
Author 
Tan, Chuan Seng. editor. Gutmann, Ronald J. editor. Reif, L. Rafael. editor. SpringerLink (Online service)
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Electronic Access 
http://dx.doi.org/10.1007/978-0-387-76534-1
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11. 
Cover image for Light-Emitting Diodes Materials, Processes, Devices and Applications
Light-Emitting Diodes Materials, Processes, Devices and Applications
Author 
Li, Jinmin. editor. Zhang, G. Q. editor. SpringerLink (Online service)
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Electronic Access 
https://doi.org/10.1007/978-3-319-99211-2
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12. 
Cover image for Fundamentals of Lead-Free Solder Interconnect Technology From Microstructures to Reliability
Fundamentals of Lead-Free Solder Interconnect Technology From Microstructures to Reliability
Author 
Lee, Tae-Kyu. author. Bieler, Thomas R. author. Kim, Choong-Un. author. Ma, Hongtao. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-1-4614-9266-5
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