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1. 
Cover image for Electronic and photonic circuits and devices
Electronic and photonic circuits and devices
Author 
Waynant, Ronald W. Lowell, John. IEEE Circuits and Systems Society. Components, Packaging & Manufacturing Technology Society.
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ONLINE
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IEEE Xplore http://ieeexplore.ieee.org/xpl/bkabstractplus.jsp?bkn=5263558
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2. 
Cover image for MEMS/MOEMS packaging concepts, designs, materials, and processes
MEMS/MOEMS packaging concepts, designs, materials, and processes
Author 
Gilleo, Ken.
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ONLINE
Electronic Access 
Subscription required
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Online Library~1
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