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1. 
Cover image for Recent Advances in Microelectronics Reliability Contributions from the European ECSEL JU project iRel40
Recent Advances in Microelectronics Reliability Contributions from the European ECSEL JU project iRel40
Author 
van Driel, Willem Dirk. editor. Pressel, Klaus. editor. Soyturk, Mujdat. editor. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
https://doi.org/10.1007/978-3-031-59361-1
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2. 
Cover image for Fundamentals and Principles of Electromagnetic Wave Absorbers From Theory, Design, and Materials to Measurement
Fundamentals and Principles of Electromagnetic Wave Absorbers From Theory, Design, and Materials to Measurement
Author 
Kim, Sung-Soo. author. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
https://doi.org/10.1007/978-981-97-6477-8
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3. 
Cover image for Flash Memories Economic Principles of Performance, Cost and Reliability Optimization
Flash Memories Economic Principles of Performance, Cost and Reliability Optimization
Author 
Richter, Detlev. author. SpringerLink (Online service)
Preferred Shelf Number 
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Electronic Access 
https://doi.org/10.1007/978-94-007-6082-0
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4. 
Cover image for Silicon Components and Processes Self Study Field-Effect Transistors
Silicon Components and Processes Self Study Field-Effect Transistors
Author 
El-Kareh, Badih. author. Hutter, Lou N. author. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
https://doi.org/10.1007/978-3-031-59193-8
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5. 
Cover image for Silicon Components and Processes Self Study Unit Processes and Process Integration
Silicon Components and Processes Self Study Unit Processes and Process Integration
Author 
El-Kareh, Badih. author. Hutter, Lou N. author. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
https://doi.org/10.1007/978-3-031-59219-5
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6. 
Cover image for Silicon Components and Processes Self Study Properties of Silicon Crystals and PN Junctions
Silicon Components and Processes Self Study Properties of Silicon Crystals and PN Junctions
Author 
El-Kareh, Badih. author. Hutter, Lou N. author. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
https://doi.org/10.1007/978-3-031-59185-3
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7. 
Cover image for Proceedings of SIE 2023 54th Annual Meeting of the Italian Electronics Society
Proceedings of SIE 2023 54th Annual Meeting of the Italian Electronics Society
Author 
Ciofi, Carmine. editor. Limiti, Ernesto. editor. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
https://doi.org/10.1007/978-3-031-48711-8
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8. 
Cover image for Silicon Components and Processes Self Study Integrated High-Voltage Transistors and Passive Components
Silicon Components and Processes Self Study Integrated High-Voltage Transistors and Passive Components
Author 
El-Kareh, Badih. author. Hutter, Lou N. author. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
https://doi.org/10.1007/978-3-031-59201-0
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9. 
Cover image for Flip Chip, Hybrid Bonding, Fan-In, and Fan-Out Technology
Flip Chip, Hybrid Bonding, Fan-In, and Fan-Out Technology
Author 
Lau, John H. author. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
https://doi.org/10.1007/978-981-97-2140-5
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10. 
Cover image for Silicon Components and Processes Self Study Rectifying and Ohmic Contacts, Bipolar Junction Transistors
Silicon Components and Processes Self Study Rectifying and Ohmic Contacts, Bipolar Junction Transistors
Author 
El-Kareh, Badih. author. Hutter, Lou N. author. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
https://doi.org/10.1007/978-3-031-59189-1
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11. 
Cover image for Passive and Active Circuits by Example
Passive and Active Circuits by Example
Author 
Yuce, Erkan. author. Minaei, Shahram. author. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
https://doi.org/10.1007/978-3-031-44966-6
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12. 
Cover image for More-than-Moore Devices and Integration for Semiconductors
More-than-Moore Devices and Integration for Semiconductors
Author 
Iacopi, Francesca. editor. Balestra, Francis. editor. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
https://doi.org/10.1007/978-3-031-21610-7
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