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49. 
Cover image for Thermal management materials for electronic packaging : preparation, characterization, and devices
Thermal management materials for electronic packaging : preparation, characterization, and devices
Author 
Tian, Xingyou, editor.
Preferred Shelf Number 
TK7870.15
Electronic Access 
https://onlinelibrary.wiley.com/doi/book/10.1002/9783527843121
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50. 
Cover image for Flexible electronic packaging and encapsulation technology
Flexible electronic packaging and encapsulation technology
Author 
Meng, Hong, editor. Huang, Wei, editor.
Preferred Shelf Number 
TK7870.15 .F54 2024
Electronic Access 
https://onlinelibrary.wiley.com/doi/book/10.1002/9783527845729
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51. 
Cover image for MXene reinforced polymer composites : fabrication, characterization and applications
MXene reinforced polymer composites : fabrication, characterization and applications
Author 
Deshmukh, Kalim, editor Pandey, Mayank, editor Hussain, Chaudhery Mustansar, editor
Preferred Shelf Number 
TA418.9 .C6
Electronic Access 
https://onlinelibrary.wiley.com/doi/book/10.1002/9781119901280
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52. 
Cover image for Smart antennas for 5G+
Smart antennas for 5G+
Author 
Sánchez-Hernández, David A., author.
Preferred Shelf Number 
TK7871.67 .A33 S26 2024
Electronic Access 
https://onlinelibrary.wiley.com/doi/book/10.1002/9781394210510
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53. 
Cover image for Group III-nitride semiconductor optoelectronics
Group III-nitride semiconductor optoelectronics
Author 
Praharaj, C. Jayant author
Preferred Shelf Number 
TK7871.99 .C65 P73 2024
Electronic Access 
https://onlinelibrary.wiley.com/doi/book/10.1002/9781119708681
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54. 
Cover image for Colloidal quantum dot light emitting diodes : materials and devices
Colloidal quantum dot light emitting diodes : materials and devices
Author 
Meng, Hong, 1966- author.
Preferred Shelf Number 
TK7871.89 .L53
Electronic Access 
https://onlinelibrary.wiley.com/doi/book/10.1002/9783527845149
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55. 
Cover image for Low-grade heat harvesting : materials, devices, and technologies
Low-grade heat harvesting : materials, devices, and technologies
Author 
Zhang, Xiaogang, author.
Preferred Shelf Number 
TK2896 .Z43 2024
Electronic Access 
https://onlinelibrary.wiley.com/doi/book/10.1002/9783527843688
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56. 
Cover image for Peptide self-assembly and engineering : fundamentals, structures, and applications
Peptide self-assembly and engineering : fundamentals, structures, and applications
Author 
Yan, Xuehai, editor.
Preferred Shelf Number 
QP552 .P4
Electronic Access 
https://onlinelibrary.wiley.com/doi/book/10.1002/9783527841264
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57. 
Cover image for Redox-active ligands : concepts and catalysis
Redox-active ligands : concepts and catalysis
Author 
Desage-El Murr, Marine, editor.
Preferred Shelf Number 
QD474
Electronic Access 
https://onlinelibrary.wiley.com/doi/book/10.1002/9783527830879
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58. 
Cover image for Advances in Bioinformatics and Computational Biology 16th Brazilian Symposium on Bioinformatics, BSB 2023, Curitiba, Brazil, June 13-16, 2023, Proceedings
Advances in Bioinformatics and Computational Biology 16th Brazilian Symposium on Bioinformatics, BSB 2023, Curitiba, Brazil, June 13-16, 2023, Proceedings
Author 
Reis, Marcelo S. editor. de Melo-Minardi, Raquel C. editor. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
https://doi.org/10.1007/978-3-031-42715-2
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59. 
Cover image for Music in the AI Era 15th International Symposium, CMMR 2021, Virtual Event, November 15-19, 2021, Revised Selected Papers
Music in the AI Era 15th International Symposium, CMMR 2021, Virtual Event, November 15-19, 2021, Revised Selected Papers
Author 
Aramaki, Mitsuko. editor. Hirata, Keiji. editor. Kitahara, Tetsuro. editor. Kronland-Martinet, Richard. editor. Ystad, Sølvi. editor.
Preferred Shelf Number 
ONLINE
Electronic Access 
https://doi.org/10.1007/978-3-031-35382-6
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60. 
Cover image for Human Interface and the Management of Information Thematic Area, HIMI 2023, Held as Part of the 25th HCI International Conference, HCII 2023, Copenhagen, Denmark, July 23-28, 2023, Proceedings, Part I
Human Interface and the Management of Information Thematic Area, HIMI 2023, Held as Part of the 25th HCI International Conference, HCII 2023, Copenhagen, Denmark, July 23-28, 2023, Proceedings, Part I
Author 
Mori, Hirohiko. editor. Asahi, Yumi. editor. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
https://doi.org/10.1007/978-3-031-35132-7
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