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61. 
Cover image for Micro-Relay Technology for Energy-Efficient Integrated Circuits
Micro-Relay Technology for Energy-Efficient Integrated Circuits
Author 
Kam, Hei. author. Chen, Fred. author. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
https://doi.org/10.1007/978-1-4939-2128-7
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62. 
Cover image for Arbitrary Modeling of TSVs for 3D Integrated Circuits
Arbitrary Modeling of TSVs for 3D Integrated Circuits
Author 
Salah, Khaled. author. Ismail, Yehea. author. El-Rouby, Alaa. author. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
https://doi.org/10.1007/978-3-319-07611-9
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63. 
Cover image for On-Chip Electro-Static Discharge (ESD) Protection for Radio-Frequency Integrated Circuits
On-Chip Electro-Static Discharge (ESD) Protection for Radio-Frequency Integrated Circuits
Author 
Cui, Qiang. author. Liou, Juin J. author. Hajjar, Jean-Jacques. author. Salcedo, Javier. author. Zhou, Yuanzhong. author.
Preferred Shelf Number 
ONLINE
Electronic Access 
https://doi.org/10.1007/978-3-319-10819-3
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64. 
Cover image for Design of 3D integrated circuits and systems
Design of 3D integrated circuits and systems
Author 
Sharma, Rohit, editor.
Preferred Shelf Number 
TK7874.893 .D48 2014
Electronic Access 
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65. 
Cover image for Ultra-Low Power Integrated Circuit Design Circuits, Systems, and Applications
Ultra-Low Power Integrated Circuit Design Circuits, Systems, and Applications
Author 
Tan, Nianxiong Nick. editor. Li, Dongmei. editor. Wang, Zhihua. editor. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
https://doi.org/10.1007/978-1-4419-9973-3
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66. 
Cover image for Advanced Field-Solver Techniques for RC Extraction of Integrated Circuits
Advanced Field-Solver Techniques for RC Extraction of Integrated Circuits
Author 
Yu, Wenjian. author. Wang, Xiren. author. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
https://doi.org/10.1007/978-3-642-54298-5
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67. 
Cover image for Testing for small-delay defects in nanoscale CMOS integrated circuits
Testing for small-delay defects in nanoscale CMOS integrated circuits
Author 
Goel, Sandeep K, editor of compilation. Chakrabarty, Krishnendu, editor of compilation.
Preferred Shelf Number 
TK7871.99 .M44 T43 2014
Electronic Access 
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68. 
Cover image for Design for High Performance, Low Power, and Reliable 3D Integrated Circuits
Design for High Performance, Low Power, and Reliable 3D Integrated Circuits
Author 
Lim, Sung Kyu. author. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE(330852.1)
Electronic Access 
http://dx.doi.org/10.1007/978-1-4419-9542-1
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69. 
Cover image for Multi-Objective Optimization in Physical Synthesis of Integrated Circuits
Multi-Objective Optimization in Physical Synthesis of Integrated Circuits
Author 
A. Papa, David. author. L. Markov, Igor. author. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE(331264.1)
Electronic Access 
http://dx.doi.org/10.1007/978-1-4614-1356-1
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70. 
Cover image for Variation-Aware Design of Custom Integrated Circuits: A Hands-on Field Guide A Hands-on Field Guide
Variation-Aware Design of Custom Integrated Circuits: A Hands-on Field Guide A Hands-on Field Guide
Author 
McConaghy, Trent. author. Breen, Kristopher. author. Dyck, Jeffrey. author. Gupta, Amit. author. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE(331305.1)
Electronic Access 
http://dx.doi.org/10.1007/978-1-4614-2269-3
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71. 
Cover image for Precision Instrumentation Amplifiers and Read-Out Integrated Circuits
Precision Instrumentation Amplifiers and Read-Out Integrated Circuits
Author 
Wu, Rong. author. Huijsing, Johan H. author. Makinwa, Kofi A. A. author. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE(331369.1)
Electronic Access 
http://dx.doi.org/10.1007/978-1-4614-3731-4
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72. 
Cover image for Electrical modeling and design for 3D system integration : 3D integrated circuits and packaging, signal integrity, power integrity and EMC
Electrical modeling and design for 3D system integration : 3D integrated circuits and packaging, signal integrity, power integrity and EMC
Author 
Li, Er-Ping.
Preferred Shelf Number 
TK7874.893 L53 2012
Format: 
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