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25. 
Cover image for Micromechanical Photonics
Micromechanical Photonics
Author 
Ukita, Hiroo. author. SpringerLink (Online service)
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ONLINE
Electronic Access 
http://dx.doi.org/10.1007/978-3-540-31372-4
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26. 
Cover image for Integrated Chemical Microsensor Systems in CMOS Technology
Integrated Chemical Microsensor Systems in CMOS Technology
Author 
Hierlemann, Andreas. author. Baltes, H. editor. Fujita, Hiroyuki. editor. Liepmann, Dorian. editor. SpringerLink (Online service)
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ONLINE
Electronic Access 
http://dx.doi.org/10.1007/b138987
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27. 
Cover image for Force Sensors for Microelectronic Packaging Applications
Force Sensors for Microelectronic Packaging Applications
Author 
Schwizer, Jürg. author. Mayer, Michael. author. Brand, Oliver. author. SpringerLink (Online service)
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ONLINE
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http://dx.doi.org/10.1007/b138345
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28. 
Cover image for CCD Image Sensors in Deep-Ultraviolet Degradation Behavior and Damage Mechanisms
CCD Image Sensors in Deep-Ultraviolet Degradation Behavior and Damage Mechanisms
Author 
Li, Flora M. author. Nathan, Arokia. author. SpringerLink (Online service)
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Electronic Access 
http://dx.doi.org/10.1007/b139047
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29. 
Cover image for Micro and Nanoelectronics Devices, Circuits and Systems Select Proceedings of MNDCS 2022
Micro and Nanoelectronics Devices, Circuits and Systems Select Proceedings of MNDCS 2022
Author 
Lenka, Trupti Ranjan. editor. Misra, Durgamadhab. editor. Fu, Lan. editor. SpringerLink (Online service)
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ONLINE
Electronic Access 
https://doi.org/10.1007/978-981-19-2308-1
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30. 
Cover image for Fly Cutting Technology for Ultra-precision Machining
Fly Cutting Technology for Ultra-precision Machining
Author 
To, Suet. editor. Wang, Sujuan. editor. SpringerLink (Online service)
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ONLINE
Electronic Access 
https://doi.org/10.1007/978-981-99-0738-0
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31. 
Cover image for Microactuators, Microsensors and Micromechanisms MAMM 2022
Microactuators, Microsensors and Micromechanisms MAMM 2022
Author 
Pandey, Ashok Kumar. editor. Pal, Prem. editor. Nagahanumaiah. editor. Zentner, Lena. editor. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-031-20353-4
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32. 
Cover image for Advances in Intelligent Manufacturing and Mechatronics Selected Articles from the Innovative Manufacturing, Mechatronics & Materials Forum (iM3F 2022), Pahang, Malaysia
Advances in Intelligent Manufacturing and Mechatronics Selected Articles from the Innovative Manufacturing, Mechatronics & Materials Forum (iM3F 2022), Pahang, Malaysia
Author 
Abdullah, Muhammad Amirul. editor. Khairuddin, Ismail Mohd. editor. Ab. Nasir, Ahmad Fakhri. editor. Mohd. Isa, Wan Hasbullah. editor. Mohd. Razman, Mohd. Azraai. editor.
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ONLINE
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https://doi.org/10.1007/978-981-19-8703-8
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33. 
Cover image for Chiplet Design and Heterogeneous Integration Packaging
Chiplet Design and Heterogeneous Integration Packaging
Author 
Lau, John H. author. SpringerLink (Online service)
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Electronic Access 
https://doi.org/10.1007/978-981-19-9917-8
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34. 
Cover image for Metasurfaces: Towards Tunable and Reconfigurable Meta-devices
Metasurfaces: Towards Tunable and Reconfigurable Meta-devices
Author 
Zhu, Weiming. author. Liu, Ai-Qun. author. SpringerLink (Online service)
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Electronic Access 
https://doi.org/10.1007/978-981-19-6925-6
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35. 
Cover image for Nanomedicine
Nanomedicine
Author 
Gu, Ning. editor. SpringerLink (Online service)
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https://doi.org/10.1007/978-981-16-8984-0
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36. 
Cover image for Fundamentals of Nanomechanical Resonators
Fundamentals of Nanomechanical Resonators
Author 
Schmid, Silvan. author. Villanueva, Luis Guillermo. author. Roukes, Michael Lee. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-031-29628-4
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