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Subject: Semiconductor wafers.
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Auberton-Herv�, A. J., e
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Through-silicon vias for 3D integration
Through-silicon vias for 3D integration
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Lau, John.
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Silicon Wafer Bonding Technology for VLSI and MEMS Applications
Silicon Wafer Bonding Technology for VLSI and MEMS Applications
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Iyer, S. S., ed. Auberton-Herv�, A. J., e
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http://dx.doi.org/10.1049/PBEP001E
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