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1. 
Cover image for Diffusion Processes in Advanced Technological Materials
Diffusion Processes in Advanced Technological Materials
Author 
Gupta, Devendra. editor. SpringerLink (Online service)
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ONLINE
Electronic Access 
http://dx.doi.org/10.1007/978-3-540-27470-4
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2. 
Cover image for Charged Semiconductor Defects Structure, Thermodynamics and Diffusion
Charged Semiconductor Defects Structure, Thermodynamics and Diffusion
Author 
Seebauer, Edmund G. author. Kratzer, Meredith C. author. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
http://dx.doi.org/10.1007/978-1-84882-059-3
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3. 
Cover image for Research on Chemical Mechanical Polishing Mechanism of Novel Diffusion Barrier Ru for Cu Interconnect
Research on Chemical Mechanical Polishing Mechanism of Novel Diffusion Barrier Ru for Cu Interconnect
Author 
Cheng, Jie. author. SpringerLink (Online service)
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ONLINE
Electronic Access 
https://doi.org/10.1007/978-981-10-6165-3
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