Search Results for Electronic packaging

1.

Advanced electronic packaging

Author

Brown, William D., 1943- Ulrich, Richard K. (Richard Kevin), 1955-

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2.

Advanced electronic packaging

Author

Ulrich, Richard K. (Richard Kevin), 1955- Brown, William D., 1943-

Preferred Shelf Number

ONLINE

Electronic Access

IEEE Xplore http://ieeexplore.ieee.org/xpl/bkabstractplus.jsp?bkn=5769522

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3.

The electronic packaging handbook

Author

Blackwell, Glenn R.

Preferred Shelf Number

TK7870.15 .E4233 2000

Electronic Access

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4.

Electronic Packaging Materials and Their Properties

Author

Pecht, Michael, author. Agarwal, Rakish, author. Dishongh, Terrance J., author. Javadpour, Sirus, author. Mahajan, Rahul, author.

Preferred Shelf Number

TK7870.15 P434 2017

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5.

Flexible electronic packaging and encapsulation technology

Author

Meng, Hong, editor. Huang, Wei, editor.

Preferred Shelf Number

TK7870.15 .F54 2024

Electronic Access

https://onlinelibrary.wiley.com/doi/book/10.1002/9783527845729

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6.

Polymeric materials for electronic packaging

Author

Nakamura, Shozo (Professor Emeritus), author.

Preferred Shelf Number

QD382 .C66 N35 2023

Electronic Access

https://onlinelibrary.wiley.com/doi/book/10.1002/9781394188826

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7.

Electronic packaging science and technology

Author

Tu, K. N. (King-Ning), 1937- author. Chen, Chih, 1970- author. Chen, Hung-Ming, author.

Preferred Shelf Number

TK7870.15 .T85 2022

Electronic Access

https://onlinelibrary.wiley.com/doi/book/10.1002/9781119418344

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8.

Nano-Bio- Electronic, Photonic and MEMS Packaging

Author

Wong, C.P. editor. Moon, Kyoung-Sik. editor. Li, Yi (Grace). editor. SpringerLink (Online service)

Preferred Shelf Number

ONLINE

Electronic Access

http://dx.doi.org/10.1007/978-1-4419-0040-1

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9.

Thermal management materials for electronic packaging : preparation, characterization, and devices

Author

Tian, Xingyou, editor.

Preferred Shelf Number

TK7870.15

Electronic Access

https://onlinelibrary.wiley.com/doi/book/10.1002/9783527843121

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10.

Thermal and structural electronic packaging analysis for space and extreme environments

Author

Cepeda-Rizo, Juan, author. Gayle, Jeremiah, author. Ravich, Joshua, author.

Preferred Shelf Number

TK7870.15

Electronic Access

Taylor & Francis https://www.taylorfrancis.com/books/9781003247005
OCLC metadata license agreement http://www.oclc.org/content/dam/oclc/forms/terms/vbrl-201703.pdf

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11.

Bio and Nano Packaging Techniques for Electron Devices Advances in Electronic Device Packaging

Author

Gerlach, Gerald. editor. Wolter, Klaus-Jürgen. editor. SpringerLink (Online service)

Preferred Shelf Number

ONLINE

Electronic Access

http://dx.doi.org/10.1007/978-3-642-28522-6

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12.

Power Electronic Packaging Design, Assembly Process, Reliability and Modeling

Author

Liu, Yong. author. SpringerLink (Online service)

Preferred Shelf Number

ONLINE

Electronic Access

http://dx.doi.org/10.1007/978-1-4614-1053-9

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13.

Advanced Materials for Thermal Management of Electronic Packaging

Author

Tong, Xingcun Colin. author. SpringerLink (Online service)

Preferred Shelf Number

ONLINE

Electronic Access

http://dx.doi.org/10.1007/978-1-4419-7759-5

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14.

Micro- and opto-electronic materials and structures : physics, mechanics, design, reliability, packaging

Author

Suhir, Ephraim. Lee, Y. C. Wong, C. P.

Preferred Shelf Number

TK7874 .M438 2007 V.1

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15.

Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging

Author

Suhir, E. editor. Lee, Y. C. editor. Wong, C. P. editor. SpringerLink (Online service)

Preferred Shelf Number

ONLINE

Electronic Access

http://dx.doi.org/10.1007/0-387-32989-7

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16.

Contamination of electronic assemblies

Author

Pecht, Michael.

Preferred Shelf Number

TK7870.15 C66 2003

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17.

Recent Trends in VLSI and Semiconductor Packaging

Author

Vasudeva Reddy, T., editor. Madhava Rao, K., editor.

Preferred Shelf Number

TK7870.15

Electronic Access

Taylor & Francis https://www.taylorfrancis.com/books/9781003616399
OCLC metadata license agreement http://www.oclc.org/content/dam/oclc/forms/terms/vbrl-201703.pdf

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18.

Functional polyimide dielectrics : structure, properties, and applications

Author

Zha, Jun-Wei, editor.

Preferred Shelf Number

TK7872 .D53 F86 2025

Electronic Access

https://onlinelibrary.wiley.com/doi/book/10.1002/9783527849031

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19.

Advances in Printing, Packaging and Communication Technologies

Author

Song, Huihui. editor. Xu, Min. editor. Yang, Li. editor. Zhang, Linghao. editor. SpringerLink (Online service)

Preferred Shelf Number

ONLINE

Electronic Access

https://doi.org/10.1007/978-981-96-4467-4

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20.

Technological Advances and Trends in Cheese Making

Author

Mansha Rafiq, Syed. editor. SpringerLink (Online service)

Preferred Shelf Number

ONLINE

Electronic Access

https://doi.org/10.1007/978-3-031-94476-5

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21.

PRACTICAL GUIDE FOR THE RELIABLE PACKAGING OF ELECTRONICS thermal and mechanical design and... analysis.

Author

JAMNIA, ALI.

Preferred Shelf Number

TK7870.15

Electronic Access

Taylor & Francis https://www.taylorfrancis.com/books/9781003564485
OCLC metadata license agreement http://www.oclc.org/content/dam/oclc/forms/terms/vbrl-201703.pdf

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22.

Innovative Technologies for Printing, Packaging and Digital Media

Author

Song, Huihui. editor. Xu, Min. editor. Yang, Li. editor. Zhang, Linghao. editor. Yan, Shu. editor.

Preferred Shelf Number

ONLINE

Electronic Access

https://doi.org/10.1007/978-981-99-9955-2

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23.

Planar microwave sensors

Author

Martín, Ferran, 1965- author. Vélez, Paris, author. Muñoz-Enano, Jonathan, author. Su, Lijuan, author.

Preferred Shelf Number

TK7876 .M22 2023

Electronic Access

https://onlinelibrary.wiley.com/doi/book/10.1002/9781119811060

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24.

Sensing technologies for real time monitoring of water quality

Author

Manjakkal, Libu, author. Lorenzelli, Leandro, author. Willander, M., author.

Preferred Shelf Number

TD367 .M3175 2023

Electronic Access

https://onlinelibrary.wiley.com/doi/book/10.1002/9781119775843

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25.

Open circuits : the inner beauty of electronic components

Author

Schlaepfe, Eric. Oskay, Windell H.

Preferred Shelf Number

TK7870.15 S33 2023

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26.

Inkjet printing in industry : materials, technologies, systems, and applications

Author

Zapka, Werner, editor.

Preferred Shelf Number

Z252.5 .I48 I55 2022

Electronic Access

https://onlinelibrary.wiley.com/doi/book/10.1002/9783527828074

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27.

Semiconductor basics : a qualitative, non-mathematical explanation of how semiconductors work and how they are used

Author

Domingo, George, 1937- author.

Preferred Shelf Number

TK7871.85 .D66 2020

Electronic Access

https://onlinelibrary.wiley.com/doi/book/10.1002/9781119597124

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28.

Lead-free soldering process development and reliability

Author

Bath, Jasbir, editor.

Preferred Shelf Number

TK7870.15 .L434 2020

Electronic Access

https://onlinelibrary.wiley.com/doi/book/10.1002/9781119482093

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29.

Electronic enclosures, housings and packages

Author

Süli, Frank, author.

Preferred Shelf Number

ONLINE

Electronic Access

ScienceDirect https://www.sciencedirect.com/science/book/9780081023914

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30.

Advances in embedded and fan-out wafer level packaging technologies

Author

Keser, Beth, 1971- editor. Kroehnert, Steffen, 1970- editor.

Preferred Shelf Number

TK7870.17 .A38 2019

Electronic Access

https://onlinelibrary.wiley.com/doi/book/10.1002/9781119313991

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31.

Harsh environment electronics : interconnect materials and performance assessment

Author

Sharif, Ahmed, editor.

Preferred Shelf Number

TK7871

Electronic Access

https://onlinelibrary.wiley.com/doi/book/10.1002/9783527813964

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32.

Food and drink--good manufacturing practice : a guide to its responsible management

Author

Manning, Louise, editor.

Preferred Shelf Number

TP369 .G7

Electronic Access

https://onlinelibrary.wiley.com/doi/book/10.1002/9781119388494

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33.

Smart electronic systems : heterogeneous integration of silicon and printed electronics

Author

Zheng, Li-Rong, author. Tenhunen, Hannu, author. Zou, Zhuo, author.

Preferred Shelf Number

TK7872 .P75

Electronic Access

https://onlinelibrary.wiley.com/doi/book/10.1002/9783527691685

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34.

Materials for Advanced Packaging

Author

Lu, Daniel. editor. Wong, C.P. editor. SpringerLink (Online service)

Preferred Shelf Number

ONLINE

Electronic Access

https://doi.org/10.1007/978-3-319-45098-8

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35.

3D Microelectronic Packaging From Fundamentals to Applications

Author

Li, Yan. editor. Goyal, Deepak. editor. SpringerLink (Online service)

Preferred Shelf Number

ONLINE

Electronic Access

https://doi.org/10.1007/978-3-319-44586-1

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36.

RF and Microwave Microelectronics Packaging II

Author

Kuang, Ken. editor. Sturdivant, Rick. editor. SpringerLink (Online service)

Preferred Shelf Number

ONLINE

Electronic Access

https://doi.org/10.1007/978-3-319-51697-4

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37.

Fundamentals of Electronic Systems Design

Author

Lienig, Jens. author. (orcid)0000-0002-2140-4587 Bruemmer, Hans. author. SpringerLink (Online service)

Preferred Shelf Number

ONLINE

Electronic Access

https://doi.org/10.1007/978-3-319-55840-0

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38.

Handbook of Damage Mechanics Nano to Macro Scale for Materials and Structures

Author

Voyiadjis, George Z. editor. SpringerLink (Online service)

Preferred Shelf Number

ONLINE

Electronic Access

https://doi.org/10.1007/978-1-4614-5589-9

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39.

Extreme environment electronics

Author

Cressler, John D. Mantooth, H. Alan, 1963-

Preferred Shelf Number

TK7870.24 .E97 2013

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40.

Hermeticity of electronic packages

Author

Greenhouse, Hal. Lowry, Robert (Robert K.), 1944- Romenesko, Bruce.

Preferred Shelf Number

ONLINE

Electronic Access

ScienceDirect http://www.sciencedirect.com/science/book/9781437778779

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41.

MEMS/MOEMS packaging concepts, designs, materials, and processes

Author

Gilleo, Ken.

Preferred Shelf Number

ONLINE

Electronic Access

Subscription required

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42.

LED packaging for lighting applications design, manufacturing, and testing

Author

Liu, S. (Sheng), 1963- Luo, Xiaobing, 1974-

Preferred Shelf Number

ONLINE

Electronic Access

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John Wiley http://dx.doi.org/10.1002/9780470827857
http://site.ebrary.com/lib/alltitles/Doc?id=10490643

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43.

Practical guide to the packaging of electronics : thermal and mechanical design and analysis

Author

Jamnia, Ali, 1961- author.

Preferred Shelf Number

TK7870.15 .J36 2009

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44.

Ceramic interconnect technology handbook

Author

Barlow, Fred D. Elshabini, Aicha.

Preferred Shelf Number

TK7871.15 .C4 C44 2007

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45.

Optical inspection of microsystems

Author

Osten, Wolfgang.

Preferred Shelf Number

TS156.2 .O652 2007

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46.

Drug products for clinical trials

Author

Monkhouse, Donald C. Carney, Charles (Charles F.) Clark, Jim.

Preferred Shelf Number

RM301.27 .D796 2006

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47.

The engineering handbook

Author

Dorf, Richard C.

Preferred Shelf Number

TA151 .E424 2005

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48.

Adhesives technology for electronic applications materials, processes, reliability

Author

Licari, James J., 1930- Swanson, Dale W.

Preferred Shelf Number

ONLINE

Electronic Access

ScienceDirect http://www.sciencedirect.com/science/book/9780815515135

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49.

The electronics handbook

Author

Whitaker, Jerry C.

Preferred Shelf Number

TK7867 .E4244 2005

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50.

Lead-free soldering in electronics : science, technology and environmental impact

Author

Suganuma, Katsuaki.

Preferred Shelf Number

TK7870.15 .L43 2004

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51.

Handbook of Moire measurement

Author

Walker, C. A. (Colin A.)

Preferred Shelf Number

QC415 .H27 2004

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52.

MEMS Packaging

Author

Tai-Ran Hsu, ed.

Preferred Shelf Number

ONLINE

Electronic Access

http://dx.doi.org/10.1049/PBEP003E

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53.

Handbook of lead-free solder technology for microelectronic assemblies

Author

Puttlitz, Karl J. Stalter, Kathleen A.

Preferred Shelf Number

TK7870.15 .H3657 2004

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54.

Reflow soldering processes SMT, BGA, CSP and flip chip technologies

Author

Lee, Ning-Cheng.

Preferred Shelf Number

ONLINE

Electronic Access

Volltext http://www.sciencedirect.com/science/book/9780750672184

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55.

Thermal design of electronic equipment

Author

Remsburg, Ralph., author.

Preferred Shelf Number

TK7870.25 .R46 2001

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56.

Run-to-run control in semiconductor manufacturing

Author

Del Castillo, Enrique. Hurwitz, Arnon Max. Moyne, James.

Preferred Shelf Number

TK7871.85 .R863 2001

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57.

Hermeticity of electronic packages

Author

Greenhouse, Hal.

Preferred Shelf Number

ONLINE

Electronic Access

ScienceDirect http://www.sciencedirect.com/science/book/9780815514350

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58.

Electronic techniques : shop practices and construction

Author

Villanucci, Robert S., 1944- Avtgis, Alexander W. Megow, William F.

Preferred Shelf Number

TK7836 .V55 1996

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59.

Microwave Field-Effect Transistors Theory, design and applications

Author

Pengelly, Raymond S.

Preferred Shelf Number

ONLINE

Electronic Access

http://dx.doi.org/10.1049/SBEW016E

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