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1. 
Cover image for Handbook of wafer bonding
Handbook of wafer bonding
Author 
Ramm, Peter. Lu, James Jian-Qiang. Taklo, Maaike M. V.
Preferred Shelf Number 
ONLINE
Electronic Access 
John Wiley http://dx.doi.org/10.1002/9783527644223
Ebook Library http://public.eblib.com/EBLPublic/PublicView.do?ptiID=822735
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2. 
Cover image for Handbook of 3D integration technology and applications of 3D integrated circuits
Handbook of 3D integration technology and applications of 3D integrated circuits
Author 
Garrou, Philip E. Bower, Christopher Andrew. Ramm, Peter. Wiley InterScience (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
Connect to MyiLibrary resource.
John Wiley http://dx.doi.org/10.1002/9783527623051
ebrary http://site.ebrary.com/id/10577606
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