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1. 
Cover image for Embedded and fan-out wafer and panel level packaging technologies for advanced application spaces : high performance compute and system-in-package
Embedded and fan-out wafer and panel level packaging technologies for advanced application spaces : high performance compute and system-in-package
Author 
Keser, Beth, 1971- editor. Kröhnert, Steffen, editor.
Preferred Shelf Number 
TK7870.15 .E43 2021
Electronic Access 
https://onlinelibrary.wiley.com/doi/book/10.1002/9781119793908
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2. 
Cover image for Antenna-in-package technology and applications
Antenna-in-package technology and applications
Author 
Liu, Duixian, editor. Zhang, Yueping, editor.
Preferred Shelf Number 
TK7871.67 .M5 A58 2020
Electronic Access 
https://onlinelibrary.wiley.com/doi/book/10.1002/9781119556671
Format: 
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3. 
Cover image for Advances in embedded and fan-out wafer level packaging technologies
Advances in embedded and fan-out wafer level packaging technologies
Author 
Keser, Beth, 1971- editor. Kroehnert, Steffen, 1970- editor.
Preferred Shelf Number 
TK7870.17 .A38 2019
Electronic Access 
https://onlinelibrary.wiley.com/doi/book/10.1002/9781119313991
Format: 
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4. 
Cover image for Progress in adhesion and adhesives. Volume 4
Progress in adhesion and adhesives. Volume 4
Author 
Mittal, K. L., 1945- editor.
Preferred Shelf Number 
TP968
Electronic Access 
https://onlinelibrary.wiley.com/doi/book/10.1002/9781119625322
Format: 
Availability 
Online Library~1
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