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1. 
Cover image for ESD in silicon integrated circuits
ESD in silicon integrated circuits
Author 
Amerasekera, E. A. Duvvury, Charvaka, 1944- Wiley InterScience (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
John Wiley http://dx.doi.org/10.1002/0470846054
HathiTrust Digital Library Limited view (search only) http://catalog.hathitrust.org/api/volumes/oclc/48109807.html
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2. 
Cover image for Process Technology for Silicon Carbide Devices
Process Technology for Silicon Carbide Devices
Author 
Zetterling, Carl-Mikael, ed.
Preferred Shelf Number 
ONLINE
Electronic Access 
http://dx.doi.org/10.1049/PBEP002E
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3. 
Cover image for Silicon molecular beam epitaxy proceedings of the 3rd International Symposium on Silicon Molecular Beam Epitaxy, Symposium A of the 1989 E-MRS Conference, Strasbourg, France, 30 May-2 June 1989
Silicon molecular beam epitaxy proceedings of the 3rd International Symposium on Silicon Molecular Beam Epitaxy, Symposium A of the 1989 E-MRS Conference, Strasbourg, France, 30 May-2 June 1989
Author 
International Symposium on Silicon Molecular Beam Epitaxy (3rd : 1989 : Strasbourg, France) Kasper, Erich. Parker, E. H. C. European Materials Research Society.
Preferred Shelf Number 
ONLINE
Electronic Access 
ScienceDirect http://www.sciencedirect.com/science/book/9780444886200
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4. 
Cover image for Soil, fertilizer, and plant silicon research in Japan
Soil, fertilizer, and plant silicon research in Japan
Author 
Ma, Jian Feng. Takahashi, Eiichi, 1927-
Preferred Shelf Number 
ONLINE
Electronic Access 
ScienceDirect http://www.sciencedirect.com/science/book/9780444511669
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5. 
Cover image for Work in the new economy flexible labor markets in Silicon Valley
Work in the new economy flexible labor markets in Silicon Valley
Author 
Benner, Chris. Wiley InterScience (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
John Wiley http://dx.doi.org/10.1002/9780470696163
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6. 
Cover image for The electrochemistry of silicon instrumentation, science, materials and applications
The electrochemistry of silicon instrumentation, science, materials and applications
Author 
Lehmann, Volker, 1938- Wiley InterScience (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
John Wiley http://dx.doi.org/10.1002/3527600272
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7. 
Cover image for Silicon Wafer Bonding Technology for VLSI and MEMS Applications
Silicon Wafer Bonding Technology for VLSI and MEMS Applications
Author 
Iyer, S. S., ed. Auberton-Herv�, A. J., e
Preferred Shelf Number 
ONLINE
Electronic Access 
http://dx.doi.org/10.1049/PBEP001E
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8. 
Cover image for Silicon germanium materials & devices a market & technology overview to 2006
Silicon germanium materials & devices a market & technology overview to 2006
Author 
Szweda, Roy.
Preferred Shelf Number 
ONLINE
Electronic Access 
ScienceDirect http://www.sciencedirect.com/science/book/9781856173964
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9. 
Cover image for Fabrication of silicon microprobes for optical near-field applications
Fabrication of silicon microprobes for optical near-field applications
Author 
Minh, Phan Ngoc., author. Esashi, Masayoshi, 1949- Takahito, Ono.
Preferred Shelf Number 
TJ1191.5 .M5526 2002
Electronic Access 
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10. 
Cover image for Readings in hardware/software co-design
Readings in hardware/software co-design
Author 
De Micheli, Giovanni. Ernst, Rolf. Wolf, Wayne.
Preferred Shelf Number 
ONLINE
Electronic Access 
ScienceDirect http://www.sciencedirect.com/science/book/9781558607026
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11. 
Cover image for Contact angle, wettability and adhesion. Volume 2
Contact angle, wettability and adhesion. Volume 2
Author 
Mittal, Kash L., 1945- editor. Taylor and Francis.
Preferred Shelf Number 
QD506
Electronic Access 
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12. 
Cover image for Electrochemical microsystem technologies
Electrochemical microsystem technologies
Author 
Datta, Madhav. Osaka, Tetsuya, 1945- Schultze, J. W. (Joachim Walter)
Preferred Shelf Number 
TP255 .E38 2002
Electronic Access 
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