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1. 
Cover image for Three Dimensional System Integration IC Stacking Process and Design
Three Dimensional System Integration IC Stacking Process and Design
Author 
Papanikolaou, Antonis. editor. Soudris, Dimitrios. editor. Radojcic, Riko. editor. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-1-4419-0962-6
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2. 
Cover image for Integration of distributed generation in the power system
Integration of distributed generation in the power system
Author 
Bollen, Math H. J., 1960-
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IEEE Xplore http://ieeexplore.ieee.org/servlet/opac?bknumber=6047601
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3. 
Cover image for Multiprocessor System-on-Chip Hardware Design and Tool Integration
Multiprocessor System-on-Chip Hardware Design and Tool Integration
Author 
Hübner, Michael. editor. Becker, Jürgen. editor. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-1-4419-6460-1
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4. 
Cover image for Introduction to microsystem packaging technology
Introduction to microsystem packaging technology
Author 
Jin, Yufeng. Wang, Zhiping, 1962- Oct. 6- Chen, Jing, 1974-
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5. 
Cover image for Recent advances in biochemistry
Recent advances in biochemistry
Author 
Hunter, William, 1971- Trimm, Harold H. (Harold Henry), 1955-
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6. 
Cover image for LabVIEW a developer's guide to real world integration
LabVIEW a developer's guide to real world integration
Author 
Fairweather, Ian. Brumfield, Anne.
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7. 
Cover image for Immigrant settlement policy in Canadian municipalities
Immigrant settlement policy in Canadian municipalities
Author 
Young, Robert, 1950- Tolley, Erin.
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http://www.jstor.org/stable/10.2307/j.ctt7ztnd
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