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1. 
Cover image for IEEE Circuits and systems magazine.
IEEE Circuits and systems magazine.
Preferred Shelf Number 
ALFABETİK V.2 2002
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2. 
Cover image for Emerging Electronic Devices, Circuits and Systems Select Proceedings of EEDCS Workshop Held in Conjunction with ISDCS 2022
Emerging Electronic Devices, Circuits and Systems Select Proceedings of EEDCS Workshop Held in Conjunction with ISDCS 2022
Author 
Giri, Chandan. editor. Iizuka, Takahiro. editor. Rahaman, Hafizur. editor. Bhattacharya, Bhargab B. editor. SpringerLink (Online service)
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ONLINE
Electronic Access 
https://doi.org/10.1007/978-981-99-0055-8
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3. 
Cover image for Micro and Nanoelectronics Devices, Circuits and Systems Select Proceedings of MNDCS 2022
Micro and Nanoelectronics Devices, Circuits and Systems Select Proceedings of MNDCS 2022
Author 
Lenka, Trupti Ranjan. editor. Misra, Durgamadhab. editor. Fu, Lan. editor. SpringerLink (Online service)
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ONLINE
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https://doi.org/10.1007/978-981-19-2308-1
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4. 
Cover image for Mathematical Modeling of Physical Systems Applications of Fields, Circuits and Signal Processing
Mathematical Modeling of Physical Systems Applications of Fields, Circuits and Signal Processing
Author 
Chattopadhyay, Adhir Baran. author. Hasan, Shazia. author. Chowdhury, Snehaunshu. author. SpringerLink (Online service)
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ONLINE
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https://doi.org/10.1007/978-981-19-7558-5
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5. 
Cover image for Microelectronics, Circuits and Systems Select Proceedings of Micro2021
Microelectronics, Circuits and Systems Select Proceedings of Micro2021
Author 
Biswas, Abhijit. editor. Islam, Aminul. editor. Chaujar, Rishu. editor. Jaksic, Olga. editor. SpringerLink (Online service)
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ONLINE
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https://doi.org/10.1007/978-981-99-0412-9
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6. 
Cover image for Generalized Principle of Pattern Multiplication and Its Applications
Generalized Principle of Pattern Multiplication and Its Applications
Author 
Geng, Junping. author. Ren, Chaofan. author. Wang, Kun. author. Liu, Erwei. author. Zhang, Jing. author.
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ONLINE
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https://doi.org/10.1007/978-981-19-3559-6
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7. 
Cover image for Mapping Innovation The Discipline of Building Opportunity across Value Chains
Mapping Innovation The Discipline of Building Opportunity across Value Chains
Author 
Anis, Mohab. author. Chawky, Sarah. author. Abdel Halim, Aya. author. SpringerLink (Online service)
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ONLINE
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https://doi.org/10.1007/978-3-030-93627-3
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8. 
Cover image for Planar Spiral Inductors, Planar Antennas and Embedded Planar Transformers SPICE-based Design and Performance Evaluation for Wireless Communications
Planar Spiral Inductors, Planar Antennas and Embedded Planar Transformers SPICE-based Design and Performance Evaluation for Wireless Communications
Author 
Banerjee, Amal. author. SpringerLink (Online service)
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ONLINE
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https://doi.org/10.1007/978-3-031-08778-3
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9. 
Cover image for Essential Circuit Analysis using LTspice®
Essential Circuit Analysis using LTspice®
Author 
Asadi, Farzin. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-031-09853-6
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10. 
Cover image for Communications, Signal Processing, and Systems Proceedings of the 11th International Conference on Communications, Signal Processing, and Systems, Vol. 3
Communications, Signal Processing, and Systems Proceedings of the 11th International Conference on Communications, Signal Processing, and Systems, Vol. 3
Author 
Liang, Qilian. editor. Wang, Wei. editor. Liu, Xin. editor. Na, Zhenyu. editor. Zhang, Baoju. editor.
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ONLINE
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https://doi.org/10.1007/978-981-99-2362-5
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11. 
Cover image for Cloud Computing with Security and Scalability. Concepts and Practices
Cloud Computing with Security and Scalability. Concepts and Practices
Author 
Sehgal, Naresh Kumar. author. Bhatt, Pramod Chandra P. author. Acken, John M. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-031-07242-0
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12. 
Cover image for Selected Sensor Circuits From Data Sheet to Simulation
Selected Sensor Circuits From Data Sheet to Simulation
Author 
Baumann, Peter. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-658-38212-4
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