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1. 
Cover image for Semiconductor packaging : materials interaction and reliability
Semiconductor packaging : materials interaction and reliability
Author 
Chen, Andrea., author. Lo, Randy.
Preferred Shelf Number 
TK7870.15 .C54 2012
Electronic Access 
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2. 
Cover image for Wide Bandgap Power Semiconductor Packaging : Materials, Components, and Reliability
Wide Bandgap Power Semiconductor Packaging : Materials, Components, and Reliability
Author 
Suganuma, Katsuaki, editor.
Preferred Shelf Number 
ONLINE
Electronic Access 
ScienceDirect https://www.sciencedirect.com/science/book/9780081020944
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3. 
Cover image for Embedded and fan-out wafer and panel level packaging technologies for advanced application spaces : high performance compute and system-in-package
Embedded and fan-out wafer and panel level packaging technologies for advanced application spaces : high performance compute and system-in-package
Author 
Keser, Beth, 1971- editor. Kröhnert, Steffen, editor.
Preferred Shelf Number 
TK7870.15 .E43 2021
Electronic Access 
https://onlinelibrary.wiley.com/doi/book/10.1002/9781119793908
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4. 
Cover image for Quantum-well laser array packaging nanoscale packaging techniques
Quantum-well laser array packaging nanoscale packaging techniques
Author 
Tomm, Jens W. Jim�enez, J. (Juan)
Preferred Shelf Number 
ONLINE
Electronic Access 
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