Limit Search Results
Author
SpringerLink (Online service)
(27)
Hierlemann, Andreas. author.
(2)
Wang, Zhiming M. editor.
(2)
Adibi, Ali. editor.
(1)
Andersson, Cristina. author.
(1)
Language
Publication Date
-
Subject
Material Type
Shelf Location
Library
Switch to list view
Switch to thumbnail view
27 Results Found Subscribe to search results
000000000000DEFAULT
Print
1. 
Cover image for Reliability of Microtechnology Interconnects, Devices and Systems
Reliability of Microtechnology Interconnects, Devices and Systems
Author 
Liu, Johan. author. Salmela, Olli. author. Sarkka, Jussi. author. Morris, James E. author. Tegehall, Per-Erik. author.
Preferred Shelf Number 
ONLINE
Electronic Access 
http://dx.doi.org/10.1007/978-1-4419-5760-3
Format: 
Availability 
Online Library~1
Available:
Copies:
2. 
Cover image for Piezotronics and Piezo-Phototronics
Piezotronics and Piezo-Phototronics
Author 
Wang, Zhong Lin. author. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
http://dx.doi.org/10.1007/978-3-642-34237-0
Format: 
Availability 
Online Library~1
Available:
Copies:
3. 
Cover image for Piezoelectric Multilayer Beam Bending Actuators Static and Dynamic Behavior and Aspects of Sensor Integration
Piezoelectric Multilayer Beam Bending Actuators Static and Dynamic Behavior and Aspects of Sensor Integration
Author 
Ballas, Rüdiger G. author. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
http://dx.doi.org/10.1007/978-3-540-32642-7
Format: 
Availability 
Online Library~1
Available:
Copies:
4. 
Cover image for CMOS Hotplate Chemical Microsensors
CMOS Hotplate Chemical Microsensors
Author 
Graf, Markus. author. Barrettino, Diego. author. Baltes, Henry P. author. Hierlemann, Andreas. author. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
http://dx.doi.org/10.1007/978-3-540-69562-2
Format: 
Availability 
Online Library~1
Available:
Copies:
5. 
Cover image for Force Sensors for Microelectronic Packaging Applications
Force Sensors for Microelectronic Packaging Applications
Author 
Schwizer, Jürg. author. Mayer, Michael. author. Brand, Oliver. author. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
http://dx.doi.org/10.1007/b138345
Format: 
Availability 
Online Library~1
Available:
Copies:
6. 
Cover image for Integrated Chemical Microsensor Systems in CMOS Technology
Integrated Chemical Microsensor Systems in CMOS Technology
Author 
Hierlemann, Andreas. author. Baltes, H. editor. Fujita, Hiroyuki. editor. Liepmann, Dorian. editor. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
http://dx.doi.org/10.1007/b138987
Format: 
Availability 
Online Library~1
Available:
Copies:
7. 
Cover image for CCD Image Sensors in Deep-Ultraviolet Degradation Behavior and Damage Mechanisms
CCD Image Sensors in Deep-Ultraviolet Degradation Behavior and Damage Mechanisms
Author 
Li, Flora M. author. Nathan, Arokia. author. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
http://dx.doi.org/10.1007/b139047
Format: 
Availability 
Online Library~1
Available:
Copies:
8. 
Cover image for Molecular Communications An Analysis from Networking Theories Perspective
Molecular Communications An Analysis from Networking Theories Perspective
Author 
Cevallos, Yesenia. author. Vacacela Gómez, Cristian. author. Tello-Oquendo, Luis. author. (orcid)0000-0002-5274-666X Tene, Talia. author. Inca, Deysi. author.
Preferred Shelf Number 
ONLINE
Electronic Access 
https://doi.org/10.1007/978-3-031-36882-0
Format: 
Availability 
Online Library~1
Available:
Copies:
9. 
Cover image for Materials for Advanced Packaging
Materials for Advanced Packaging
Author 
Lu, Daniel. editor. Wong, C.P. editor. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
https://doi.org/10.1007/978-3-319-45098-8
Format: 
Availability 
Online Library~1
Available:
Copies:
10. 
Cover image for 3D Microelectronic Packaging From Fundamentals to Applications
3D Microelectronic Packaging From Fundamentals to Applications
Author 
Li, Yan. editor. Goyal, Deepak. editor. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
https://doi.org/10.1007/978-3-319-44586-1
Format: 
Availability 
Online Library~1
Available:
Copies:
11. 
Cover image for Modeling, Methodologies and Tools for Molecular and Nano-scale Communications Modeling, Methodologies and Tools
Modeling, Methodologies and Tools for Molecular and Nano-scale Communications Modeling, Methodologies and Tools
Author 
Suzuki, Junichi. editor. Nakano, Tadashi. editor. Moore, Michael John. editor. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
https://doi.org/10.1007/978-3-319-50688-3
Format: 
Availability 
Online Library~1
Available:
Copies:
12. 
Cover image for Plasmonic Organic Solar Cells Charge Generation and Recombination
Plasmonic Organic Solar Cells Charge Generation and Recombination
Author 
Wu, Bo. author. Mathews, Nripan. author. Sum, Tze-Chien. author. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
https://doi.org/10.1007/978-981-10-2021-6
Format: 
Availability 
Online Library~1
Available:
Copies:
Go to:Search Results
|
Top of Page
|
Search Facets