Limit Search Results
Author
Language
Publication Date
-
Subject
Material Type
Shelf Location
Library
Switch to list view
Switch to thumbnail view
6 Results Found Subscribe to search results
000000DEFAULT
Print
1. 
Cover image for Chiplet Design and Heterogeneous Integration Packaging
Chiplet Design and Heterogeneous Integration Packaging
Author 
Lau, John H. author. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
https://doi.org/10.1007/978-981-19-9917-8
Format: 
Availability 
Online Library~1
Available:
Copies:
2. 
Cover image for Interconnect Reliability in Advanced Memory Device Packaging
Interconnect Reliability in Advanced Memory Device Packaging
Author 
Gan, Chong Leong,. author. Huang, Chen-Yu,. author. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
https://doi.org/10.1007/978-3-031-26708-6
Format: 
Availability 
Online Library~1
Available:
Copies:
3. 
Cover image for Photonic Packaging Sourcebook Fiber-Chip Coupling for Optical Components, Basic Calculations, Modules
Photonic Packaging Sourcebook Fiber-Chip Coupling for Optical Components, Basic Calculations, Modules
Author 
Fischer-Hirchert, Ulrich H. P. author. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
https://doi.org/10.1007/978-3-642-25376-8
Format: 
Availability 
Online Library~1
Available:
Copies:
4. 
Cover image for Wafer-Level Chip-Scale Packaging Analog and Power Semiconductor Applications
Wafer-Level Chip-Scale Packaging Analog and Power Semiconductor Applications
Author 
Qu, Shichun. author. Liu, Yong. author. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
https://doi.org/10.1007/978-1-4939-1556-9
Format: 
Availability 
Online Library~1
Available:
Copies:
5. 
Cover image for Electronic and photonic circuits and devices
Electronic and photonic circuits and devices
Author 
Waynant, Ronald W. Lowell, John. IEEE Circuits and Systems Society. Components, Packaging & Manufacturing Technology Society.
Preferred Shelf Number 
ONLINE
Electronic Access 
IEEE Xplore http://ieeexplore.ieee.org/xpl/bkabstractplus.jsp?bkn=5263558
Format: 
Availability 
Online Library~1
Available:
Copies:
6. 
Cover image for Mapping Innovation The Discipline of Building Opportunity across Value Chains
Mapping Innovation The Discipline of Building Opportunity across Value Chains
Author 
Anis, Mohab. author. Chawky, Sarah. author. Abdel Halim, Aya. author. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
https://doi.org/10.1007/978-3-030-93627-3
Format: 
Availability 
Online Library~1
Available:
Copies:
Go to:Search Results
|
Top of Page
|
Search Facets