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Cover image for PRACTICAL GUIDE FOR THE RELIABLE PACKAGING OF ELECTRONICS thermal and mechanical design and... analysis.
PRACTICAL GUIDE FOR THE RELIABLE PACKAGING OF ELECTRONICS thermal and mechanical design and... analysis.
Author 
JAMNIA, ALI.
Preferred Shelf Number 
TK7870.15
Electronic Access 
Taylor & Francis https://www.taylorfrancis.com/books/9781003564485
OCLC metadata license agreement http://www.oclc.org/content/dam/oclc/forms/terms/vbrl-201703.pdf
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2. 
Cover image for Thermal and structural electronic packaging analysis for space and extreme environments
Thermal and structural electronic packaging analysis for space and extreme environments
Author 
Cepeda-Rizo, Juan, author. Gayle, Jeremiah, author. Ravich, Joshua, author.
Preferred Shelf Number 
TK7870.15
Electronic Access 
Taylor & Francis https://www.taylorfrancis.com/books/9781003247005
OCLC metadata license agreement http://www.oclc.org/content/dam/oclc/forms/terms/vbrl-201703.pdf
Format: 
Availability 
Online Library~1
Available:
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3. 
Cover image for Practical guide to the packaging of electronics : thermal and mechanical design and analysis
Practical guide to the packaging of electronics : thermal and mechanical design and analysis
Author 
Jamnia, Ali, 1961- author.
Preferred Shelf Number 
TK7870.15 .J36 2009
Electronic Access 
Click here to view.
Format: 
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