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1. 
Cover image for Smart sensors for industry 4.0 : fundamentals, fabrication and IIoT applications
Smart sensors for industry 4.0 : fundamentals, fabrication and IIoT applications
Author 
Mishra, Brojo Kishore, 1979- editor. Mallik, Sandipan, editor. Le, Dac-Nhuong, 1983- editor.
Preferred Shelf Number 
TK7872 .D48 S63 2024
Electronic Access 
https://onlinelibrary.wiley.com/doi/book/10.1002/9781394214723
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2. 
Cover image for Applications in Electronics and Computing Systems Proceedings of the 4th International Conference on Applications in Electronics and Computing Systems AECS-2022
Applications in Electronics and Computing Systems Proceedings of the 4th International Conference on Applications in Electronics and Computing Systems AECS-2022
Author 
Dantsevich, Igor. editor. Samoylenko, Irina. editor. (orcid)0000-0001-6907-1403 SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
https://doi.org/10.1007/978-3-031-20631-3
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3. 
Cover image for Handbook of 3D integration. Volume 4, Design, test, and thermal management
Handbook of 3D integration. Volume 4, Design, test, and thermal management
Author 
Franzon, Paul D., editor. Marinissen, Eric Jan, editor. Bakir, Muhannad S., editor.
Preferred Shelf Number 
TK7874.893 .H36 2019
Electronic Access 
https://onlinelibrary.wiley.com/doi/book/10.1002/9783527697052
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4. 
Cover image for Getting Started with Tiva ARM Cortex M4 Microcontrollers A Lab Manual for Tiva LaunchPad Evaluation Kit
Getting Started with Tiva ARM Cortex M4 Microcontrollers A Lab Manual for Tiva LaunchPad Evaluation Kit
Author 
Gadre, Dhananjay V. author. Gupta, Sarthak. author. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
https://doi.org/10.1007/978-81-322-3766-2
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5. 
Cover image for From additive manufacturing to 3D/4D printing. 2, Current techniques, improvements and their limitations
From additive manufacturing to 3D/4D printing. 2, Current techniques, improvements and their limitations
Author 
André, Jean-Claude, author.
Preferred Shelf Number 
TS171.95
Electronic Access 
https://onlinelibrary.wiley.com/doi/book/10.1002/9781119428299
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6. 
Cover image for From additive manufacturing to 3D/4D printing. 1, From concepts to achievements
From additive manufacturing to 3D/4D printing. 1, From concepts to achievements
Author 
André, Jean-Claude, author.
Preferred Shelf Number 
TS171.95
Electronic Access 
https://onlinelibrary.wiley.com/doi/book/10.1002/9781119428510
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7. 
Cover image for Design for Manufacturability From 1D to 4D for 90–22 nm Technology Nodes
Design for Manufacturability From 1D to 4D for 90–22 nm Technology Nodes
Author 
Balasinski, Artur. author. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
https://doi.org/10.1007/978-1-4614-1761-3
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8. 
Cover image for Technological Innovation for the Internet of Things 4th IFIP WG 5.5/SOCOLNET Doctoral Conference on Computing, Electrical and Industrial Systems, DoCEIS 2013, Costa de Caparica, Portugal, April 15-17, 2013. Proceedings
Technological Innovation for the Internet of Things 4th IFIP WG 5.5/SOCOLNET Doctoral Conference on Computing, Electrical and Industrial Systems, DoCEIS 2013, Costa de Caparica, Portugal, April 15-17, 2013. Proceedings
Author 
Camarinha-Matos, Luis M. editor. Tomic, Slavisa. editor. Graça, Paula. editor. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE(334402.1)
Electronic Access 
http://dx.doi.org/10.1007/978-3-642-37291-9
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9. 
Cover image for Communication Systems and Information Technology Selected Papers from the 2011 International Conference on Electric and Electronics (EEIC 2011) in Nanchang, China on June 20-22, 2011, Volume 4
Communication Systems and Information Technology Selected Papers from the 2011 International Conference on Electric and Electronics (EEIC 2011) in Nanchang, China on June 20-22, 2011, Volume 4
Author 
Ma, Ming. editor. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
http://dx.doi.org/10.1007/978-3-642-21762-3
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10. 
Cover image for Deep learning on embedded systems : a hands-on approach using Jetson Nano and Raspberry Pi
Deep learning on embedded systems : a hands-on approach using Jetson Nano and Raspberry Pi
Author 
Arif, Tariq M., author. John Wiley & Sons, publisher.
Preferred Shelf Number 
Q325.73 .A75 2025
Electronic Access 
https://onlinelibrary.wiley.com/doi/book/10.1002/9781394269297
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11. 
Cover image for Composites-based perovskite solar cells
Composites-based perovskite solar cells
Author 
Hahn, Yoon-Bong, author Wang, Yousheng, author Mahmoudi, Tahmineh, author
Preferred Shelf Number 
TK2963 .P47
Electronic Access 
https://onlinelibrary.wiley.com/doi/book/10.1002/9783527844548
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12. 
Cover image for Single element semiconductors : properties and devices
Single element semiconductors : properties and devices
Author 
Shi, Yi (Electrical engineer), author. Yan, Shancheng, author.
Preferred Shelf Number 
TK7871.85 .S55 2025
Electronic Access 
https://onlinelibrary.wiley.com/doi/book/10.1002/9783527851782
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