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1. 
Cover image for Polymeric materials for electronic packaging
Polymeric materials for electronic packaging
Author 
Nakamura, Shozo (Professor Emeritus), author.
Preferred Shelf Number 
QD382 .C66 N35 2023
Electronic Access 
https://onlinelibrary.wiley.com/doi/book/10.1002/9781394188826
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2. 
Cover image for Nano-Bio- Electronic, Photonic and MEMS Packaging
Nano-Bio- Electronic, Photonic and MEMS Packaging
Author 
Wong, C.P. editor. Moon, Kyoung-Sik. editor. Li, Yi (Grace). editor. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
http://dx.doi.org/10.1007/978-1-4419-0040-1
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3. 
Cover image for Power Electronic Packaging Design, Assembly Process, Reliability and Modeling
Power Electronic Packaging Design, Assembly Process, Reliability and Modeling
Author 
Liu, Yong. author. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
http://dx.doi.org/10.1007/978-1-4614-1053-9
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4. 
Cover image for Advanced Materials for Thermal Management of Electronic Packaging
Advanced Materials for Thermal Management of Electronic Packaging
Author 
Tong, Xingcun Colin. author. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
http://dx.doi.org/10.1007/978-1-4419-7759-5
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5. 
Cover image for Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging
Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging
Author 
Suhir, E. editor. Lee, Y. C. editor. Wong, C. P. editor. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
http://dx.doi.org/10.1007/0-387-32989-7
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6. 
Cover image for Sensing technologies for real time monitoring of water quality
Sensing technologies for real time monitoring of water quality
Author 
Manjakkal, Libu, author. Lorenzelli, Leandro, author. Willander, M., author.
Preferred Shelf Number 
TD367 .M3175 2023
Electronic Access 
https://onlinelibrary.wiley.com/doi/book/10.1002/9781119775843
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7. 
Cover image for Semiconductor basics : a qualitative, non-mathematical explanation of how semiconductors work and how they are used
Semiconductor basics : a qualitative, non-mathematical explanation of how semiconductors work and how they are used
Author 
Domingo, George, 1937- author.
Preferred Shelf Number 
TK7871.85 .D66 2020
Electronic Access 
https://onlinelibrary.wiley.com/doi/book/10.1002/9781119597124
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8. 
Cover image for Advances in embedded and fan-out wafer level packaging technologies
Advances in embedded and fan-out wafer level packaging technologies
Author 
Keser, Beth, 1971- editor. Kroehnert, Steffen, 1970- editor.
Preferred Shelf Number 
TK7870.17 .A38 2019
Electronic Access 
https://onlinelibrary.wiley.com/doi/book/10.1002/9781119313991
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9. 
Cover image for RF and Microwave Microelectronics Packaging II
RF and Microwave Microelectronics Packaging II
Author 
Kuang, Ken. editor. Sturdivant, Rick. editor. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
https://doi.org/10.1007/978-3-319-51697-4
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10. 
Cover image for 3D Microelectronic Packaging From Fundamentals to Applications
3D Microelectronic Packaging From Fundamentals to Applications
Author 
Li, Yan. editor. Goyal, Deepak. editor. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
https://doi.org/10.1007/978-3-319-44586-1
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11. 
Cover image for Materials for Advanced Packaging
Materials for Advanced Packaging
Author 
Lu, Daniel. editor. Wong, C.P. editor. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
https://doi.org/10.1007/978-3-319-45098-8
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