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1. 
Cover image for Reliable Design of Electronic Equipment An Engineering Guide
Reliable Design of Electronic Equipment An Engineering Guide
Author 
Natarajan, Dhanasekharan. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-319-09111-2
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2. 
Cover image for Fundamentals of Electromigration-Aware Integrated Circuit Design
Fundamentals of Electromigration-Aware Integrated Circuit Design
Author 
Lienig, Jens. author. (orcid)0000-0002-2140-4587 Rothe, Susann. author. Thiele, Matthias. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-031-80023-8
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3. 
Cover image for Hybrid Bonding, Advanced Substrates, Failure Mechanisms, and Thermal Management for Chiplets and Heterogeneous Integration
Hybrid Bonding, Advanced Substrates, Failure Mechanisms, and Thermal Management for Chiplets and Heterogeneous Integration
Author 
Lau, John. author. Fan, Xuejun. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-981-96-4166-6
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4. 
Cover image for Piezoelectric Bending Transducers The Physics of Their Static and Dynamic Behaviour A Textbook About Indispensable Actuators in Microtechnology, Mechatronics and Medical Technology
Piezoelectric Bending Transducers The Physics of Their Static and Dynamic Behaviour A Textbook About Indispensable Actuators in Microtechnology, Mechatronics and Medical Technology
Author 
Ballas, Rüdiger G. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-662-70689-3
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5. 
Cover image for Micro- and Nano-Systems in 21st-Century Designs, Developments, Applications and Perspective
Micro- and Nano-Systems in 21st-Century Designs, Developments, Applications and Perspective
Author 
Pachkawade, Vinayak. editor. Guha, Koushik. editor. SpringerLink (Online service)
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https://doi.org/10.1007/978-981-96-4659-3
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6. 
Cover image for Alternating Current Field Measurement Technique for Detection and Measurement of Cracks in Structures
Alternating Current Field Measurement Technique for Detection and Measurement of Cracks in Structures
Author 
Li, Wei. author. Yuan, Xin'an. author. Zhao, Jianming. author. Yin, Xiaokang. author. Li, Xiao. author.
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https://doi.org/10.1007/978-981-97-7255-1
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7. 
Cover image for Flip Chip, Hybrid Bonding, Fan-In, and Fan-Out Technology
Flip Chip, Hybrid Bonding, Fan-In, and Fan-Out Technology
Author 
Lau, John H. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-981-97-2140-5
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8. 
Cover image for Tapered Beams in MEMS A Symbolic Modeling Framework with Applications to Energy Harvesting
Tapered Beams in MEMS A Symbolic Modeling Framework with Applications to Energy Harvesting
Author 
Syed, Wajih U. author. Elfadel, Ibrahim (Abe) M. author. (orcid)0000-0003-3220-9987 SpringerLink (Online service)
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https://doi.org/10.1007/978-3-031-66391-8
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9. 
Cover image for Response Feature Technology for High-Frequency Electronics. Optimization, Modeling, and Design Automation
Response Feature Technology for High-Frequency Electronics. Optimization, Modeling, and Design Automation
Author 
Pietrenko-Dabrowska, Anna. author. Koziel, Slawomir. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-031-43845-5
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10. 
Cover image for Multibeam Phased Array Antennas as Satellite Constellation Ground Station
Multibeam Phased Array Antennas as Satellite Constellation Ground Station
Author 
He, Guolong. author. Gao, Xin. author. Zhang, Rentian. author. Sun, Liangliang. author. Zhou, Hui. author.
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https://doi.org/10.1007/978-981-99-7910-3
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11. 
Cover image for Integrated Data and Energy Transfer in Wireless Networks
Integrated Data and Energy Transfer in Wireless Networks
Author 
Hu, Jie. author. Yang, Kun. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-031-60514-7
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12. 
Cover image for Single Flux Quantum Integrated Circuit Design
Single Flux Quantum Integrated Circuit Design
Author 
Krylov, Gleb. author. Jabbari, Tahereh. author. Friedman, Eby G. author. (orcid)0000-0002-5549-7160 SpringerLink (Online service)
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https://doi.org/10.1007/978-3-031-47475-0
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