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Wafer-Level Chip-Scale Packaging Analog and Power Semiconductor Applications

Author

Qu, Shichun. author. Liu, Yong. author. SpringerLink (Online service)

Preferred Shelf Number

ONLINE

Electronic Access

https://doi.org/10.1007/978-1-4939-1556-9

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Thermal Transport in Oblique Finned Micro/Minichannels

Author

Fan, Yan. author. Lee, Poh Seng. author. Singh, Pawan Kumar. author. Lee, Yong Jiun. author. SpringerLink (Online service)

Preferred Shelf Number

ONLINE

Electronic Access

https://doi.org/10.1007/978-3-319-09647-6

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Advancements of Medical Electronics Proceedings of the First International Conference, ICAME 2015

Author

Gupta, Somsubhra. editor. Bag, Sandip. editor. Ganguly, Karabi. editor. Sarkar, Indranath. editor. Biswas, Papun. editor.

Preferred Shelf Number

ONLINE

Electronic Access

https://doi.org/10.1007/978-81-322-2256-9

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Advanced Thermal Management Materials

Author

Jiang, Guosheng. author. Diao, Liyong. author. Kuang, Ken. author. SpringerLink (Online service)

Preferred Shelf Number

ONLINE(331292.1)

Electronic Access

http://dx.doi.org/10.1007/978-1-4614-1963-1

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Availability

Online Library~1

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Electrical Craft Principles, Volume 1

Author

Whitfield, J.

Preferred Shelf Number

ONLINE

Electronic Access

http://dx.doi.org/10.1049/PBNS033E

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Availability

Online Library~1

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