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1. 
Cover image for Core-Shell Nanomaterials From Fundamentals to Applications
Core-Shell Nanomaterials From Fundamentals to Applications
Author 
Sharma, Shreya. Phogat, Peeyush. Thakur, Jahanvi. Singh, N. L.
Preferred Shelf Number 
XX(600416.1)
Electronic Access 
https://onlinelibrary.wiley.com/doi/book/10.1002/9783527855766
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2. 
Cover image for Next-generation electrochromic devices : from multifunctional materials to smart glasses
Next-generation electrochromic devices : from multifunctional materials to smart glasses
Author 
Cossari, Pierluigi, author.
Preferred Shelf Number 
TA1750 .C67 2025
Electronic Access 
https://onlinelibrary.wiley.com/doi/book/10.1002/9783527832583
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3. 
Cover image for Hybrid Bonding, Advanced Substrates, Failure Mechanisms, and Thermal Management for Chiplets and Heterogeneous Integration
Hybrid Bonding, Advanced Substrates, Failure Mechanisms, and Thermal Management for Chiplets and Heterogeneous Integration
Author 
Lau, John. author. Fan, Xuejun. author. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
https://doi.org/10.1007/978-981-96-4166-6
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4. 
Cover image for Piezoelectric Bending Transducers The Physics of Their Static and Dynamic Behaviour A Textbook About Indispensable Actuators in Microtechnology, Mechatronics and Medical Technology
Piezoelectric Bending Transducers The Physics of Their Static and Dynamic Behaviour A Textbook About Indispensable Actuators in Microtechnology, Mechatronics and Medical Technology
Author 
Ballas, Rüdiger G. author. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
https://doi.org/10.1007/978-3-662-70689-3
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5. 
Cover image for Nanometer CMOS ICs From Basics to ASICs
Nanometer CMOS ICs From Basics to ASICs
Author 
Veendrick, Harry. author. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
https://doi.org/10.1007/978-3-031-64249-4
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6. 
Cover image for Sensing technologies for real time monitoring of water quality
Sensing technologies for real time monitoring of water quality
Author 
Manjakkal, Libu, author. Lorenzelli, Leandro, author. Willander, M., author.
Preferred Shelf Number 
TD367 .M3175 2023
Electronic Access 
https://onlinelibrary.wiley.com/doi/book/10.1002/9781119775843
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7. 
Cover image for Smart sensors for environmental and medical applications
Smart sensors for environmental and medical applications
Author 
Hallil, Hamida, 1981- editor. Heidari, Hadi, editor.
Preferred Shelf Number 
R857 .B54 S64 2020
Electronic Access 
https://onlinelibrary.wiley.com/doi/book/10.1002/9781119587422
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8. 
Cover image for 3D Microelectronic Packaging From Fundamentals to Applications
3D Microelectronic Packaging From Fundamentals to Applications
Author 
Li, Yan. editor. Goyal, Deepak. editor. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
https://doi.org/10.1007/978-3-319-44586-1
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9. 
Cover image for Fracture Mechanics of Piezoelectric Solids with Interface Cracks
Fracture Mechanics of Piezoelectric Solids with Interface Cracks
Author 
Govorukha, Volodymyr. author. Kamlah, Marc. author. Loboda, Volodymyr. author. Lapusta, Yuri. author. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
https://doi.org/10.1007/978-3-319-53553-1
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10. 
Cover image for Nanometer CMOS ICs From Basics to ASICs
Nanometer CMOS ICs From Basics to ASICs
Author 
J.M. Veendrick, Harry. author. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
https://doi.org/10.1007/978-3-319-47597-4
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11. 
Cover image for RF and Microwave Microelectronics Packaging II
RF and Microwave Microelectronics Packaging II
Author 
Kuang, Ken. editor. Sturdivant, Rick. editor. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
https://doi.org/10.1007/978-3-319-51697-4
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12. 
Cover image for Comparators in Nanometer CMOS Technology
Comparators in Nanometer CMOS Technology
Author 
Goll, Bernhard. author. Zimmermann, Horst. author. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
https://doi.org/10.1007/978-3-662-44482-5
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