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Cover image for Metal-Dielectric Interfaces in Gigascale Electronics Thermal and Electrical Stability
Metal-Dielectric Interfaces in Gigascale Electronics Thermal and Electrical Stability
Author 
He, Ming. author. Lu, Toh-Ming. author. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-1-4614-1812-2
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2. 
Cover image for Computational Problems in Science and Engineering
Computational Problems in Science and Engineering
Author 
Mastorakis, Nikos. editor. Bulucea, Aida. editor. Tsekouras, George. editor. SpringerLink (Online service)
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ONLINE
Electronic Access 
https://doi.org/10.1007/978-3-319-15765-8
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3. 
Cover image for Fundamentals of Lead-Free Solder Interconnect Technology From Microstructures to Reliability
Fundamentals of Lead-Free Solder Interconnect Technology From Microstructures to Reliability
Author 
Lee, Tae-Kyu. author. Bieler, Thomas R. author. Kim, Choong-Un. author. Ma, Hongtao. author. SpringerLink (Online service)
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ONLINE
Electronic Access 
https://doi.org/10.1007/978-1-4614-9266-5
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