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Cover image for Advanced Packaging and Manufacturing Technology Based on Adhesion Engineering Wafer-Level Transfer Packaging and Fabrication Techniques Using Interface Energy Control Method
Advanced Packaging and Manufacturing Technology Based on Adhesion Engineering Wafer-Level Transfer Packaging and Fabrication Techniques Using Interface Energy Control Method
Author 
Seok, Seonho. author. SpringerLink (Online service)
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ONLINE
Electronic Access 
https://doi.org/10.1007/978-3-319-77872-3
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2. 
Cover image for Closed Power Cycles Thermodynamic Fundamentals and Applications
Closed Power Cycles Thermodynamic Fundamentals and Applications
Author 
Invernizzi, Costante Mario. author. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE(331155.1)
Electronic Access 
http://dx.doi.org/10.1007/978-1-4471-5140-1
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Online Library~1
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