Search Results for Packaging.

1.

Packaging for Sustainability

Author

Verghese, Karli. editor. Lewis, Helen. editor. Fitzpatrick, Leanne. editor. SpringerLink (Online service)

Preferred Shelf Number

ONLINE

Electronic Access

http://dx.doi.org/10.1007/978-0-85729-988-8

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2.

Advanced Flip Chip Packaging

Author

Tong, Ho-Ming. editor. Lai, Yi-Shao. editor. Wong, C.P. editor. SpringerLink (Online service)

Preferred Shelf Number

ONLINE(330808.1)

Electronic Access

http://dx.doi.org/10.1007/978-1-4419-5768-9

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3.

Fan-Out Wafer-Level Packaging

Author

Lau, John H. author. SpringerLink (Online service)

Preferred Shelf Number

ONLINE

Electronic Access

https://doi.org/10.1007/978-981-10-8884-1

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4.

RF and Microwave Microelectronics Packaging

Author

Kuang, Ken. editor. Kim, Franklin. editor. Cahill, Sean S. editor. SpringerLink (Online service)

Preferred Shelf Number

ONLINE

Electronic Access

http://dx.doi.org/10.1007/978-1-4419-0984-8

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5.

Integrated Circuit Packaging, Assembly and Interconnections

Author

Greig, William J. author. SpringerLink (Online service)

Preferred Shelf Number

ONLINE

Electronic Access

http://dx.doi.org/10.1007/0-387-33913-2

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6.

Cover image for Advanced Packaging and Manufacturing Technology Based on Adhesion Engineering Wafer-Level Transfer Packaging and Fabrication Techniques Using Interface Energy Control Method

Advanced Packaging and Manufacturing Technology Based on Adhesion Engineering Wafer-Level Transfer Packaging and Fabrication Techniques Using Interface Energy Control Method

Author

Seok, Seonho. author. SpringerLink (Online service)

Preferred Shelf Number

ONLINE

Electronic Access

https://doi.org/10.1007/978-3-319-77872-3

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7.

Power Electronic Packaging Design, Assembly Process, Reliability and Modeling

Author

Liu, Yong. author. SpringerLink (Online service)

Preferred Shelf Number

ONLINE

Electronic Access

http://dx.doi.org/10.1007/978-1-4614-1053-9

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8.

Advanced Materials for Thermal Management of Electronic Packaging

Author

Tong, Xingcun Colin. author. SpringerLink (Online service)

Preferred Shelf Number

ONLINE

Electronic Access

http://dx.doi.org/10.1007/978-1-4419-7759-5

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9.

Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging

Author

Suhir, E. editor. Lee, Y. C. editor. Wong, C. P. editor. SpringerLink (Online service)

Preferred Shelf Number

ONLINE

Electronic Access

http://dx.doi.org/10.1007/0-387-32989-7

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10.

Materials for Information Technology Devices, Interconnects and Packaging

Author

Zschech, Ehrenfried. editor. Whelan, Caroline. editor. Mikolajick, Thomas. editor. SpringerLink (Online service)

Preferred Shelf Number

ONLINE

Electronic Access

http://dx.doi.org/10.1007/1-84628-235-7

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