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1. 
Cover image for Wafer-Level Chip-Scale Packaging Analog and Power Semiconductor Applications
Wafer-Level Chip-Scale Packaging Analog and Power Semiconductor Applications
Author 
Qu, Shichun. author. Liu, Yong. author. SpringerLink (Online service)
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ONLINE
Electronic Access 
https://doi.org/10.1007/978-1-4939-1556-9
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2. 
Cover image for Thermal Effects in Supercapacitors
Thermal Effects in Supercapacitors
Author 
Xiong, Guoping. author. Kundu, Arpan. author. Fisher, Timothy S. author. SpringerLink (Online service)
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ONLINE
Electronic Access 
https://doi.org/10.1007/978-3-319-20242-6
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3. 
Cover image for Oscillating Heat Pipes
Oscillating Heat Pipes
Author 
Ma, Hongbin. author. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
https://doi.org/10.1007/978-1-4939-2504-9
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4. 
Cover image for Thermal Sensors Principles and Applications for Semiconductor Industries
Thermal Sensors Principles and Applications for Semiconductor Industries
Author 
Jha, Chandra Mohan. editor. SpringerLink (Online service)
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ONLINE
Electronic Access 
https://doi.org/10.1007/978-1-4939-2581-0
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