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1. 
Cover image for Thermal Transport in Oblique Finned Micro/Minichannels
Thermal Transport in Oblique Finned Micro/Minichannels
Author 
Fan, Yan. author. Lee, Poh Seng. author. Singh, Pawan Kumar. author. Lee, Yong Jiun. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-319-09647-6
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2. 
Cover image for Wafer-Level Chip-Scale Packaging Analog and Power Semiconductor Applications
Wafer-Level Chip-Scale Packaging Analog and Power Semiconductor Applications
Author 
Qu, Shichun. author. Liu, Yong. author. SpringerLink (Online service)
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ONLINE
Electronic Access 
https://doi.org/10.1007/978-1-4939-1556-9
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3. 
Cover image for Thermal Sensors Principles and Applications for Semiconductor Industries
Thermal Sensors Principles and Applications for Semiconductor Industries
Author 
Jha, Chandra Mohan. editor. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
https://doi.org/10.1007/978-1-4939-2581-0
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