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1. 
Cover image for Flip Chip, Hybrid Bonding, Fan-In, and Fan-Out Technology
Flip Chip, Hybrid Bonding, Fan-In, and Fan-Out Technology
Author 
Lau, John H. author. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
https://doi.org/10.1007/978-981-97-2140-5
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2. 
Cover image for Handbook of Advanced Lighting Technology
Handbook of Advanced Lighting Technology
Author 
Karlicek, Robert. editor. Sun, Ching-Cherng. editor. Zissis, Georges. editor. Ma, Ruiqing. editor. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
https://doi.org/10.1007/978-3-319-00176-0
Format: 
Availability 
Online Library~1
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