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1. 
Cover image for 3D Microelectronic Packaging From Fundamentals to Applications
3D Microelectronic Packaging From Fundamentals to Applications
Author 
Li, Yan. editor. Goyal, Deepak. editor. SpringerLink (Online service)
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Electronic Access 
https://doi.org/10.1007/978-3-319-44586-1
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2. 
Cover image for Laser Beam Micro-milling of Micro-channels in Aerospace Alloys
Laser Beam Micro-milling of Micro-channels in Aerospace Alloys
Author 
Darwish, Saied Muhammed Hassan. editor. Ahmed, Naveed. editor. Al-Ahmari, Abdulrahman M. editor. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
https://doi.org/10.1007/978-981-10-3602-6
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3. 
Cover image for Materials for Advanced Packaging
Materials for Advanced Packaging
Author 
Lu, Daniel. editor. Wong, C.P. editor. SpringerLink (Online service)
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ONLINE
Electronic Access 
https://doi.org/10.1007/978-3-319-45098-8
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4. 
Cover image for Electrodeposition and Surface Finishing Fundamentals and Applications
Electrodeposition and Surface Finishing Fundamentals and Applications
Author 
Djokić, Stojan S. editor. SpringerLink (Online service)
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ONLINE
Electronic Access 
https://doi.org/10.1007/978-1-4939-0289-7
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