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1. 
Cover image for Crosstalk in Modern On-Chip Interconnects A FDTD Approach
Crosstalk in Modern On-Chip Interconnects A FDTD Approach
Author 
Kaushik, B.K. author. Kumar, V. Ramesh. author. Patnaik, Amalendu. author. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
https://doi.org/10.1007/978-981-10-0800-9
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2. 
Cover image for Photonic Packaging Sourcebook Fiber-Chip Coupling for Optical Components, Basic Calculations, Modules
Photonic Packaging Sourcebook Fiber-Chip Coupling for Optical Components, Basic Calculations, Modules
Author 
Fischer-Hirchert, Ulrich H. P. author. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
https://doi.org/10.1007/978-3-642-25376-8
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3. 
Cover image for Lab-on-a-Chip Devices and Micro-Total Analysis Systems A Practical Guide
Lab-on-a-Chip Devices and Micro-Total Analysis Systems A Practical Guide
Author 
Castillo-León, Jaime. editor. Svendsen, Winnie E. editor. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
https://doi.org/10.1007/978-3-319-08687-3
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4. 
Cover image for Micro electromechanical systems (MEMS) : practical lab manual
Micro electromechanical systems (MEMS) : practical lab manual
Author 
Kumar, Sanjeet. Bhaiyya, Manish. Amreen, Khairunnisa. Kumar, Pavar Sai. Kumar, Abhishek.
Preferred Shelf Number 
TK7875 .K86 2025
Electronic Access 
https://onlinelibrary.wiley.com/doi/book/10.1002/9781394229864
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5. 
Cover image for MEMS and Microfluidics in Healthcare Devices and Applications Perspectives
MEMS and Microfluidics in Healthcare Devices and Applications Perspectives
Author 
Guha, Koushik. editor. Dutta, Gorachand. editor. (orcid)0000-0003-2980-9826 Biswas, Arindam. editor. Srinivasa Rao, K. editor. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
https://doi.org/10.1007/978-981-19-8714-4
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6. 
Cover image for Chiplet Design and Heterogeneous Integration Packaging
Chiplet Design and Heterogeneous Integration Packaging
Author 
Lau, John H. author. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
https://doi.org/10.1007/978-981-19-9917-8
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7. 
Cover image for Materials for Advanced Packaging
Materials for Advanced Packaging
Author 
Lu, Daniel. editor. Wong, C.P. editor. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
https://doi.org/10.1007/978-3-319-45098-8
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8. 
Cover image for Microsystems for Pharmatechnology Manipulation of Fluids, Particles, Droplets, and Cells
Microsystems for Pharmatechnology Manipulation of Fluids, Particles, Droplets, and Cells
Author 
Dietzel, Andreas. editor. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
https://doi.org/10.1007/978-3-319-26920-7
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9. 
Cover image for Microfluidics for Biologists Fundamentals and Applications
Microfluidics for Biologists Fundamentals and Applications
Author 
Dixit, Chandra K. editor. Kaushik, Ajeet. editor. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
https://doi.org/10.1007/978-3-319-40036-5
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10. 
Cover image for Microarray Bioprinting Technology Fundamentals and Practices
Microarray Bioprinting Technology Fundamentals and Practices
Author 
Lee, Moo-Yeal. editor. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
https://doi.org/10.1007/978-3-319-46805-1
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11. 
Cover image for Encyclopedia of Microfluidics and Nanofluidics
Encyclopedia of Microfluidics and Nanofluidics
Author 
Li, Dongqing. editor. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
https://doi.org/10.1007/978-1-4614-5491-5
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12. 
Cover image for Intelligent Computing, Communication and Devices Proceedings of ICCD 2014, Volume 1
Intelligent Computing, Communication and Devices Proceedings of ICCD 2014, Volume 1
Author 
Jain, Lakhmi C. editor. Patnaik, Srikanta. editor. Ichalkaranje, Nikhil. editor. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
https://doi.org/10.1007/978-81-322-2012-1
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