Limit Search Results
Author
Language
Publication Date
-
Subject
Material Type
Shelf Location
Library
Switch to list view
Switch to thumbnail view
13 Results Found Subscribe to search results
000000000000DEFAULT
Print
1. 
Cover image for Chiplet Design and Heterogeneous Integration Packaging
Chiplet Design and Heterogeneous Integration Packaging
Author 
Lau, John H. author. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
https://doi.org/10.1007/978-981-19-9917-8
Format: 
Availability 
Online Library~1
Available:
Copies:
2. 
Cover image for Micro and Nanoelectronics Devices, Circuits and Systems Select Proceedings of MNDCS 2022
Micro and Nanoelectronics Devices, Circuits and Systems Select Proceedings of MNDCS 2022
Author 
Lenka, Trupti Ranjan. editor. Misra, Durgamadhab. editor. Fu, Lan. editor. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
https://doi.org/10.1007/978-981-19-2308-1
Format: 
Availability 
Online Library~1
Available:
Copies:
3. 
Cover image for Ultra-low Voltage Circuit Techniques for Energy Harvesting
Ultra-low Voltage Circuit Techniques for Energy Harvesting
Author 
Radin, Rafael Luciano. author. Machado, Marcio Bender. author. Sawan, Mohamad. author. Galup-Montoro, Carlos. author. Schneider, Marcio Cherem. author.
Preferred Shelf Number 
ONLINE
Electronic Access 
https://doi.org/10.1007/978-3-031-04492-2
Format: 
Availability 
Online Library~1
Available:
Copies:
4. 
Cover image for Self Assembly: The Science of Things That Put Themselves Together.
Self Assembly: The Science of Things That Put Themselves Together.
Author 
Pelesko, John A., author.
Preferred Shelf Number 
TA418.9 .N35
Electronic Access 
Taylor & Francis https://www.taylorfrancis.com/books/e/9781584886884
Taylor & Francis https://www.taylorfrancis.com/books/e/9780429143328
Taylor & Francis https://www.taylorfrancis.com/books/9780429143328
OCLC metadata license agreement http://www.oclc.org/content/dam/oclc/forms/terms/vbrl-201703.pdf
Format: 
Availability 
Online Library~1
Available:
Copies:
5. 
Cover image for Carbon for Sensing Devices
Carbon for Sensing Devices
Author 
Demarchi, Danilo. editor. Tagliaferro, Alberto. editor. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
https://doi.org/10.1007/978-3-319-08648-4
Format: 
Availability 
Online Library~1
Available:
Copies:
6. 
Cover image for Introduction to Microsystem Design
Introduction to Microsystem Design
Author 
Schomburg, Werner Karl. author. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
https://doi.org/10.1007/978-3-662-47023-7
Format: 
Availability 
Online Library~1
Available:
Copies:
7. 
Cover image for Carbon Nanotube Based VLSI Interconnects Analysis and Design
Carbon Nanotube Based VLSI Interconnects Analysis and Design
Author 
Kaushik, Brajesh Kumar. author. Majumder, Manoj Kumar. author. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
https://doi.org/10.1007/978-81-322-2047-3
Format: 
Availability 
Online Library~1
Available:
Copies:
8. 
Cover image for Resonant Tunneling Quantum Waveguides of Variable Cross-Section, Asymptotics, Numerics, and Applications
Resonant Tunneling Quantum Waveguides of Variable Cross-Section, Asymptotics, Numerics, and Applications
Author 
Baskin, Lev. author. Neittaanmäki, Pekka. author. Plamenevskii, Boris. author. Sarafanov, Oleg. author. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
https://doi.org/10.1007/978-3-319-15105-2
Format: 
Availability 
Online Library~1
Available:
Copies:
9. 
Cover image for Micro-Relay Technology for Energy-Efficient Integrated Circuits
Micro-Relay Technology for Energy-Efficient Integrated Circuits
Author 
Kam, Hei. author. Chen, Fred. author. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
https://doi.org/10.1007/978-1-4939-2128-7
Format: 
Availability 
Online Library~1
Available:
Copies:
10. 
Cover image for Photonic Packaging Sourcebook Fiber-Chip Coupling for Optical Components, Basic Calculations, Modules
Photonic Packaging Sourcebook Fiber-Chip Coupling for Optical Components, Basic Calculations, Modules
Author 
Fischer-Hirchert, Ulrich H. P. author. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
https://doi.org/10.1007/978-3-642-25376-8
Format: 
Availability 
Online Library~1
Available:
Copies:
11. 
Cover image for Comparators in Nanometer CMOS Technology
Comparators in Nanometer CMOS Technology
Author 
Goll, Bernhard. author. Zimmermann, Horst. author. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
https://doi.org/10.1007/978-3-662-44482-5
Format: 
Availability 
Online Library~1
Available:
Copies:
12. 
Cover image for Flip-Flop Design in Nanometer CMOS From High Speed to Low Energy
Flip-Flop Design in Nanometer CMOS From High Speed to Low Energy
Author 
Alioto, Massimo. author. Consoli, Elio. author. Palumbo, Gaetano. author. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
https://doi.org/10.1007/978-3-319-01997-0
Format: 
Availability 
Online Library~1
Available:
Copies:
Go to:Search Results
|
Top of Page
|
Search Facets