Limit Search Results
Author
Language
Publication Date
-
Subject
Material Type
Shelf Location
Library
Switch to list view
Switch to thumbnail view
10 Results Found Subscribe to search results
0000000000DEFAULT
Print
1. 
Cover image for Materials for Advanced Packaging
Materials for Advanced Packaging
Author 
Lu, Daniel. editor. Wong, C.P. editor. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
https://doi.org/10.1007/978-3-319-45098-8
Format: 
Availability 
Online Library~1
Available:
Copies:
2. 
Cover image for Chiplet Design and Heterogeneous Integration Packaging
Chiplet Design and Heterogeneous Integration Packaging
Author 
Lau, John H. author. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
https://doi.org/10.1007/978-981-19-9917-8
Format: 
Availability 
Online Library~1
Available:
Copies:
3. 
Cover image for MEMS/MOEMS packaging concepts, designs, materials, and processes
MEMS/MOEMS packaging concepts, designs, materials, and processes
Author 
Gilleo, Ken.
Preferred Shelf Number 
ONLINE
Electronic Access 
Subscription required
Format: 
Availability 
Online Library~1
Available:
Copies:
4. 
Cover image for 3D Microelectronic Packaging From Fundamentals to Applications
3D Microelectronic Packaging From Fundamentals to Applications
Author 
Li, Yan. editor. Goyal, Deepak. editor. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
https://doi.org/10.1007/978-3-319-44586-1
Format: 
Availability 
Online Library~1
Available:
Copies:
5. 
Cover image for Photonic Packaging Sourcebook Fiber-Chip Coupling for Optical Components, Basic Calculations, Modules
Photonic Packaging Sourcebook Fiber-Chip Coupling for Optical Components, Basic Calculations, Modules
Author 
Fischer-Hirchert, Ulrich H. P. author. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
https://doi.org/10.1007/978-3-642-25376-8
Format: 
Availability 
Online Library~1
Available:
Copies:
6. 
Cover image for 3D and circuit integration of MEMS
3D and circuit integration of MEMS
Author 
Esashi, Masayoshi, 1949- author.
Preferred Shelf Number 
TK7875 .E73 2021 EB
Electronic Access 
https://onlinelibrary.wiley.com/doi/book/10.1002/9783527823239
Format: 
Availability 
Online Library~1
Available:
Copies:
7. 
Cover image for MEMS : fundamental technology and applications
MEMS : fundamental technology and applications
Author 
Choudhary, Vikas. Iniewski, Krzysztof.
Preferred Shelf Number 
TK7875 .M457 2013
Electronic Access 
Click here to view.
Format: 
Availability 
Online Library~1
Available:
Copies:
8. 
Cover image for MEMS and nanotechnology-based sensors and devices for communications, medical and aerospace applications
MEMS and nanotechnology-based sensors and devices for communications, medical and aerospace applications
Author 
Jha, A. R., author.
Preferred Shelf Number 
TK7875 .J485 2008
Electronic Access 
Click here to view.
Format: 
Availability 
Online Library~1
Available:
Copies:
9. 
Cover image for Microengineering, MEMS, and interfacing : a practical guide
Microengineering, MEMS, and interfacing : a practical guide
Author 
Banks, Danny., author.
Preferred Shelf Number 
TK7875 .B36 2006
Electronic Access 
Click here to view.
Format: 
Availability 
Online Library~1
Available:
Copies:
10. 
Cover image for MEMS and Microstructures in aerospace applications
MEMS and Microstructures in aerospace applications
Author 
Osiander, Robert., author. Darrin, M. Ann Garrison. Champion, John.
Preferred Shelf Number 
TL589 .O85 2006
Electronic Access 
Click here to view.
Format: 
Availability 
Online Library~1
Available:
Copies:
Go to:Search Results
|
Top of Page
|
Search Facets