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1. 
Cover image for Chiplet Design and Heterogeneous Integration Packaging
Chiplet Design and Heterogeneous Integration Packaging
Author 
Lau, John H. author. SpringerLink (Online service)
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ONLINE
Electronic Access 
https://doi.org/10.1007/978-981-19-9917-8
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2. 
Cover image for 3D and circuit integration of MEMS
3D and circuit integration of MEMS
Author 
Esashi, Masayoshi, 1949- author.
Preferred Shelf Number 
TK7875 .E73 2021 EB
Electronic Access 
https://onlinelibrary.wiley.com/doi/book/10.1002/9783527823239
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3. 
Cover image for Essentials of Single-Cell Analysis Concepts, Applications and Future Prospects
Essentials of Single-Cell Analysis Concepts, Applications and Future Prospects
Author 
Tseng, Fan-Gang. editor. Santra, Tuhin Subhra. editor. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
https://doi.org/10.1007/978-3-662-49118-8
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