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1. 
Cover image for Micro-Electrode-Dot-Array Digital Microfluidic Biochips Design Automation, Optimization, and Test Techniques
Micro-Electrode-Dot-Array Digital Microfluidic Biochips Design Automation, Optimization, and Test Techniques
Author 
Li, Zipeng. author. Chakrabarty, Krishnendu. author. Ho, Tsung-Yi. author. Lee, Chen-Yi. author. SpringerLink (Online service)
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ONLINE
Electronic Access 
https://doi.org/10.1007/978-3-030-02964-7
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2. 
Cover image for Design Automation Techniques for Approximation Circuits Verification, Synthesis and Test
Design Automation Techniques for Approximation Circuits Verification, Synthesis and Test
Author 
Chandrasekharan, Arun. author. Große, Daniel. author. Drechsler, Rolf. author. SpringerLink (Online service)
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ONLINE
Electronic Access 
https://doi.org/10.1007/978-3-319-98965-5
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3. 
Cover image for VLSI Design and Test 21st International Symposium, VDAT 2017, Roorkee, India, June 29 - July 2, 2017, Revised Selected Papers
VLSI Design and Test 21st International Symposium, VDAT 2017, Roorkee, India, June 29 - July 2, 2017, Revised Selected Papers
Author 
Kaushik, Brajesh Kumar. editor. Dasgupta, Sudeb. editor. Singh, Virendra. editor. (orcid)0000-0002-9113-5167 SpringerLink (Online service)
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Electronic Access 
https://doi.org/10.1007/978-981-10-7470-7
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4. 
Cover image for Design-for-Test and Test Optimization Techniques for TSV-based 3D Stacked ICs
Design-for-Test and Test Optimization Techniques for TSV-based 3D Stacked ICs
Author 
Noia, Brandon. author. Chakrabarty, Krishnendu. author. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
https://doi.org/10.1007/978-3-319-02378-6
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5. 
Cover image for Handbook of Computer Architecture
Handbook of Computer Architecture
Author 
Chattopadhyay, Anupam. editor. (orcid)0000-0002-8818-6983 SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
https://doi.org/10.1007/978-981-97-9314-3
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6. 
Cover image for Integrated Circuit Design Tape-out Process with Open-Source Tools
Integrated Circuit Design Tape-out Process with Open-Source Tools
Author 
Ortega Cisneros, Susana. author. Baungarten Leon, Emilio Isaac. author. (orcid)0000-0001-6243-219X Mejia Alvarez, Pedro. author. SpringerLink (Online service)
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ONLINE
Electronic Access 
https://doi.org/10.1007/978-3-031-92108-7
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7. 
Cover image for Towards Heterogeneous Multi-core Systems-on-Chip for Edge Machine Learning Journey from Single-core Acceleration to Multi-core Heterogeneous Systems
Towards Heterogeneous Multi-core Systems-on-Chip for Edge Machine Learning Journey from Single-core Acceleration to Multi-core Heterogeneous Systems
Author 
Jain, Vikram. author. (orcid)0000-0002-1267-1683 Verhelst, Marian. author. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
https://doi.org/10.1007/978-3-031-38230-7
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8. 
Cover image for Machine Learning Support for Fault Diagnosis of System-on-Chip
Machine Learning Support for Fault Diagnosis of System-on-Chip
Author 
Girard, Patrick. editor. Blanton, Shawn. editor. Wang, Li-C. editor. SpringerLink (Online service)
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Electronic Access 
https://doi.org/10.1007/978-3-031-19639-3
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9. 
Cover image for Digital system design using FSMs : a practical learning approach
Digital system design using FSMs : a practical learning approach
Author 
Minns, Peter D., author.
Preferred Shelf Number 
QA267.5 .S4 M56 2021
Electronic Access 
https://onlinelibrary.wiley.com/doi/book/10.1002/9781119782735
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10. 
Cover image for Testing of Interposer-Based 2.5D Integrated Circuits
Testing of Interposer-Based 2.5D Integrated Circuits
Author 
Wang, Ran. author. Chakrabarty, Krishnendu. author. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
https://doi.org/10.1007/978-3-319-54714-5
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11. 
Cover image for The Dark Side of Silicon Energy Efficient Computing in the Dark Silicon Era
The Dark Side of Silicon Energy Efficient Computing in the Dark Silicon Era
Author 
Rahmani, Amir M. editor. Liljeberg, Pasi. editor. Hemani, Ahmed. editor. Jantsch, Axel. editor. Tenhunen, Hannu. editor.
Preferred Shelf Number 
ONLINE
Electronic Access 
https://doi.org/10.1007/978-3-319-31596-6
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12. 
Cover image for More-than-Moore 2.5D and 3D SiP Integration
More-than-Moore 2.5D and 3D SiP Integration
Author 
Radojcic, Riko. author. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
https://doi.org/10.1007/978-3-319-52548-8
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