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Cover image for 3D Microelectronic Packaging From Fundamentals to Applications
3D Microelectronic Packaging From Fundamentals to Applications
Author 
Li, Yan. editor. Goyal, Deepak. editor. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-319-44586-1
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2. 
Cover image for Materials for Advanced Packaging
Materials for Advanced Packaging
Author 
Lu, Daniel. editor. Wong, C.P. editor. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-319-45098-8
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3. 
Cover image for Aluminum Matrix Composites Reinforced with Alumina Nanoparticles
Aluminum Matrix Composites Reinforced with Alumina Nanoparticles
Author 
Casati, Riccardo. author. SpringerLink (Online service)
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ONLINE
Electronic Access 
https://doi.org/10.1007/978-3-319-27732-5
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4. 
Cover image for Recent Trends in Nanotechnology and Materials Science Selected Review Papers from the 2013 International Conference on Manufacturing, Optimization, Industrial and Material Engineering (MOIME 2013)
Recent Trends in Nanotechnology and Materials Science Selected Review Papers from the 2013 International Conference on Manufacturing, Optimization, Industrial and Material Engineering (MOIME 2013)
Author 
Gaol, Ford Lumban. editor. Webb, Jeffrey. editor. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-319-04516-0
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