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1. 
Cover image for Emerging Technologies with Advanced Devices from Micro to Nano ETMN 2024
Emerging Technologies with Advanced Devices from Micro to Nano ETMN 2024
Author 
Mukhopadhyay, Subhas Chandra. editor. Islam, Tarikul. editor. Khan, Shakeb A. editor. Mehfuz, Shabana. editor. Khan, Mohammad Ajmal. editor.
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https://doi.org/10.1007/978-3-031-84331-0
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2. 
Cover image for Molecular Communications An Analysis from Networking Theories Perspective
Molecular Communications An Analysis from Networking Theories Perspective
Author 
Cevallos, Yesenia. author. Vacacela Gómez, Cristian. author. Tello-Oquendo, Luis. author. (orcid)0000-0002-5274-666X Tene, Talia. author. Inca, Deysi. author.
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https://doi.org/10.1007/978-3-031-36882-0
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3. 
Cover image for Metasurfaces: Towards Tunable and Reconfigurable Meta-devices
Metasurfaces: Towards Tunable and Reconfigurable Meta-devices
Author 
Zhu, Weiming. author. Liu, Ai-Qun. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-981-19-6925-6
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4. 
Cover image for Materials for Advanced Packaging
Materials for Advanced Packaging
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Lu, Daniel. editor. Wong, C.P. editor. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-319-45098-8
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5. 
Cover image for Piezoelectric MEMS Resonators
Piezoelectric MEMS Resonators
Author 
Bhugra, Harmeet. editor. Piazza, Gianluca. editor. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-319-28688-4
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6. 
Cover image for Frontiers in Electronic Technologies Trends and Challenges
Frontiers in Electronic Technologies Trends and Challenges
Author 
Prabaharan, S.R.S. editor. Thalmann, Nadia Magnenat. editor. (orcid)0000-0002-1459-5960 Kanchana Bhaaskaran, V. S. editor. SpringerLink (Online service)
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https://doi.org/10.1007/978-981-10-4235-5
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7. 
Cover image for Biomechanical Microsystems Design, Processing and Applications
Biomechanical Microsystems Design, Processing and Applications
Author 
Ostasevicius, Vytautas. author. (orcid)0000-0002-4234-6996 Janusas, Giedrius. author. Palevicius, Arvydas. author. Gaidys, Rimvydas. author. Jurenas, Vytautas. author.
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https://doi.org/10.1007/978-3-319-54849-4
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8. 
Cover image for 3D Microelectronic Packaging From Fundamentals to Applications
3D Microelectronic Packaging From Fundamentals to Applications
Author 
Li, Yan. editor. Goyal, Deepak. editor. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-319-44586-1
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9. 
Cover image for Modeling, Methodologies and Tools for Molecular and Nano-scale Communications Modeling, Methodologies and Tools
Modeling, Methodologies and Tools for Molecular and Nano-scale Communications Modeling, Methodologies and Tools
Author 
Suzuki, Junichi. editor. Nakano, Tadashi. editor. Moore, Michael John. editor. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-319-50688-3
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10. 
Cover image for Plasmonic Organic Solar Cells Charge Generation and Recombination
Plasmonic Organic Solar Cells Charge Generation and Recombination
Author 
Wu, Bo. author. Mathews, Nripan. author. Sum, Tze-Chien. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-981-10-2021-6
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11. 
Cover image for Phononic Crystals Fundamentals and Applications
Phononic Crystals Fundamentals and Applications
Author 
Khelif, Abdelkrim. editor. Adibi, Ali. editor. SpringerLink (Online service)
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https://doi.org/10.1007/978-1-4614-9393-8
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12. 
Cover image for Carbon Nanotube Based VLSI Interconnects Analysis and Design
Carbon Nanotube Based VLSI Interconnects Analysis and Design
Author 
Kaushik, Brajesh Kumar. author. Majumder, Manoj Kumar. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-81-322-2047-3
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