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1. 
Cover image for Advanced Packaging and Manufacturing Technology Based on Adhesion Engineering Wafer-Level Transfer Packaging and Fabrication Techniques Using Interface Energy Control Method
Advanced Packaging and Manufacturing Technology Based on Adhesion Engineering Wafer-Level Transfer Packaging and Fabrication Techniques Using Interface Energy Control Method
Author 
Seok, Seonho. author. SpringerLink (Online service)
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ONLINE
Electronic Access 
https://doi.org/10.1007/978-3-319-77872-3
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2. 
Cover image for Nanoscience Advances in CBRN Agents Detection, Information and Energy Security
Nanoscience Advances in CBRN Agents Detection, Information and Energy Security
Author 
Petkov, Plamen. editor. Tsiulyanu, Dumitru. editor. Kulisch, Wilhelm. editor. Popov, Cyril. editor. SpringerLink (Online service)
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ONLINE
Electronic Access 
https://doi.org/10.1007/978-94-017-9697-2
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3. 
Cover image for Quantum Dot Molecules
Quantum Dot Molecules
Author 
Wu, Jiang. editor. Wang, Zhiming M. editor. SpringerLink (Online service)
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ONLINE
Electronic Access 
https://doi.org/10.1007/978-1-4614-8130-0
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4. 
Cover image for Localized Surface Plasmon Resonance Based Nanobiosensors
Localized Surface Plasmon Resonance Based Nanobiosensors
Author 
Long, Yi-Tao. author. Jing, Chao. author. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
https://doi.org/10.1007/978-3-642-54795-9
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5. 
Cover image for Silicon Containing Copolymers
Silicon Containing Copolymers
Author 
Amiri, Sahar. author. Semsarzadeh, Mohammad Ali. author. Amiri, Sanam. author. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
https://doi.org/10.1007/978-3-319-09225-6
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6. 
Cover image for Microelectronics to nanoelectronics materials, devices & manufacturability
Microelectronics to nanoelectronics materials, devices & manufacturability
Author 
Kaul, Anupama B.
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ONLINE
Electronic Access 
Distributed by publisher. Purchase or institutional license may be required for access.
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